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MediaTek Provides Advanced Wireless Solutions for Smart Devices in Today's Connected Homes (2018.01.09)
MediaTek today announced that global brands including ASUS, D-Link and others will use MediaTek's chipsets as they develop advanced Gigabit Wi-Fi connectivity for premium routers and whole home coverage devices.
These new devices will ensure secure, high-performance whole home wireless coverage for connected devices including PCs, smartphones, televisions and AI-powered smart home devices such as voice-enabled smart speakers |
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Intel Advances Quantum and Neuromorphic Computing Research (2018.01.09)
At the 2018 Consumer Electronics Show in Las Vegas, Intel announced two major milestones in its efforts to research and develop future computing technologies including quantum and neuromorphic computing.
Intel CEO Brian Krzanich announced the successful design, fabrication and delivery of a 49-qubit superconducting quantum test chip |
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Hitachi and Clarion Announce the "Park-by-Memory" Advanced Autonomous Parking Technology (2018.01.09)
Hitachi Automotive Systems, Ltd. and Clarion Co., Ltd. today announced the development of Park-by-Memory autonomous parking technology that remembers the environment surrounding users’ home parking spaces. Moving forward, the companies will aim for the initial adoption of this system through proposals to automotive manufacturers |
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IndusInd Bank and Dynamics Introduce India’s First Battery-Powered Interactive Payment Card (2018.01.09)
IndusInd Bank and Dynamics Inc. today at the 2018 Consumer Electronics Show announced plans to introduce the first battery-powered, interactive payment cards to the Indian market in 2018.
The new IndusInd Bank card from Dynamics has multiple buttons that let the consumers use a single card to pay in multiple ways |
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Toshiba Electronic Launches Two New ICs Compliant with Bluetooth Ver.5.0 (2018.01.09)
Toshiba Electronic Devices & Storage Corporation announced "TC35680FSG” with built-in Flash ROM and "TC35681FSG," additions to its line-up of ICs compliant with the Bluetooth low energy standard. Sample shipments start at the end of this month |
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USB-IF Introduces Fast Charging to Expand its Certified USB Charger Initiative (2018.01.09)
USB Implementers Forum (USB-IF) today announced the expansion of its Certified USB Charger Compliance and Logo Program to include Certified USB Fast Chargers. Certified USB Fast Chargers support the Programmable Power Supply (PPS) feature of the USB Power Delivery 3 |
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TrendForce Says Prices of LED Package Products Will Go Down in 1Q18 (2018.01.09)
LEDinside, a division of TrendForce, reports that the prices of mainstream LED package products in China's market were generally stable in December 2017. In both high-power and mid-power segments, prices witnessed no obvious fluctuation, but the prices of LED package products are expected to go down in 1Q18 |
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Nine LAN ports and a powerful CPU help the BOXER-6640M keep an eye on all your targets (2018.01.09)
AAEON announces the release of the BOXER-6640M embedded Box PC. This feature-rich ruggedized device supports high frames per second (FPS) cameras and dynamic facial recognition software, making it ideal for both machine vision and digital surveillance applications |
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MediaTek Unveils Its Edge AI Platform & AI Technology For Cross Platform Consumer Devices (2018.01.08)
MediaTek today detailed its ongoing AI platform strategy to enable AI edge computing with its NeuroPilot AI platform. Through a combination of hardware and software, an AI processing unit (APU), and NeuroPilot SDK, MediaTek will bring AI across its wide-ranging technology portfolio -- a portfolio that powers 1 |
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HOLTEK New BC3601 Sub-1GHz FSK/GFSK RF Transceiver IC (2018.01.08)
Holtek announces the release of its new bidirectional wireless FSK/GFSK high performance transceiver IC, the BC3601. This device, which operates in the 300MHz~960MHz license-free ISM bands, is suitable for battery or IoT applications that require low power consumption, such as smart homes, intelligent security products, car alarms, industrial/agricultural controllers and many other wireless bidirectional communication products |
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Plessey Commits to Launching Industry’s First Monolithic MicroLED Displays by 1H18 (2018.01.08)
Plessey Semiconductor today announces its commitment to being the first to market with a monolithic microLED based display based on GaN-on-Silicon.
Plessey has also commenced an extensive licensing programme that will see the company license out its GaN-on-Silicon expertise to microLED manufacturers in line with its new business strategy of becoming the photonic industry’s foremost technology platform provider |
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AI and Digital Assistants to Surge in 2018, IHS Markit Says (2018.01.08)
As they become more ubiquitous in homes and in various consumer electronics products, artificial intelligence (AI) and digital assistants are likely to be two of the major overarching themes at the 2018 Consumer Electronics Show (CES) |
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Intel Launches Most Powerful and Smallest VR-Capable NUC (2018.01.08)
Intel today launched its latest and most powerful Intel NUC, based on the newly announced 8th Gen Intel Core i7 processor with Radeon RX Vega M graphics.
The new NUC will come in two versions: NUC8i7HVK and NUC8i7HNK. The NUC8i7HVK is based on the unlocked version of the new 8th Gen Intel Core processor with the Radeon RX Vega M GH graphics |
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NVIDIA and Aurora Collaborate to Build Next-Gen Autonomous Car Platform (2018.01.08)
NVIDIA and Aurora today announced that they are working together to create a new Level 4 and Level 5 self-driving hardware platform that will use the NVIDIA DRIVE Xavier™ processor.
At the opening press conference of CES 2018, NVIDIA founder and CEO Jensen Huang disclosed that NVIDIA’s automotive team is working with Aurora to bring up a new modular and scalable DRIVE Xavier platform that will bring autonomous vehicles to market |
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VR Market Shipments at 5 Million Units in 2018, TrendForce Says (2018.01.08)
TrendForce reveals that global shipments of VR devices reached 3.7 million units in 2017. In terms of shipments ranking, Sony took first place, followed by Oculus Rift in second and HTC Vive in third. As for 2018, TrendForce estimates that the shipments will come to 5 million units |
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Acer to Bring Amazon Alexa to PCs in 2018 (2018.01.08)
Acer today announces that Amazon Alexa will be coming to select Aspire, Spin, Switch and Swift notebooks, as well as Aspire all-in-one PCs starting from Q1 2018. Amazon Alexa will initially be available in the US via an update through Acer Care Center, while wider support is expected to be rolled out mid-2018 |
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Fabless IC Company Sales Top $100 Billion for First Time Ever (2018.01.07)
IC Insights released a listing of the 2017 top 50 fabless IC suppliers. Figure shows the top 10 ranking of fabless IC suppliers for 2017. Two China-based fabless companies made the top 10 ranking last year—HiSilicon, which sells most of its devices as internal transfers to smartphone supplier Huawei, and Unigroup, which includes the IC sales of both Spreadtrum and RDA |
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Acer Launches the New Swift 7, Redefining the World’s Thinnest Laptop (2018.01.07)
Acer today launches the world’s thinnest laptop, the new Swift 7 (SF714-51T). At just 8.98 mm thin, the new Swift 7 is an always-connected PC running Windows 10 that’s designed for mobility, with an ultraportable design packing a powerful Intel Core i7 processor, all-day battery life and a personal, trusted 4G LTE connection |
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Chilism Acquired Mag. Layers and Becomes the Third Largest Global Inductor Provider (2018.01.04)
TAIPEI, Taiwan - Taiwanese inductor manufacturer Chilisin Electronics Corp. announced yesterday that they had acquired a 100% share in Mag. Layers Scientific Technics Co., Ltd., which is also a Taiwanese company. Following this merger, the combined market share of the two companies now exceeds 10%, and they have become the third largest global inductor component provider |
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TrendForce Forecasts a Possible Oversupply in 2019 (2018.01.04)
According to DRAMeXchange, a division of TrendForce, the production capacity expansion of major NAND Flash manufacturers, e.g. Toshiba, Samsung, Intel, and Yangtze Memory Technologies Corporation (YMTC), will have increasing impacts on the industry, resulting in a possible oversupply in NAND Flash market in 2019 |
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