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Science and Technology
Allusion |
From the evolution of integration-introduction to
One wants to meet different market needs of general-purpose interface Bus standards, can continue to upgrade transmission speeds and greater bandwidth, to achieve speed, capacity, quality and other multivariate integration, enhance the effectiveness of desire?
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SEGA Entertainment and Acer’s StarVR Introduce Premium VR Arcade Experiences to Japan (2017.12.22)
SEGA Entertainment and premium Virtual Reality (VR) solutions provider StarVR today announced its collaboration to bring StarVR arcade experiences to existing SEGA Game Center locations throughout Japan.
StarVR will work with SEGA Entertainment to roll out its industry-leading headset and VR arcade experiences across the country, at three SEGA arcade locations by March 2018 and at more than ten locations by the end of the year |
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China’s JHICC, Innotron Memory and Tsinghua Unigroup Emerge As Major Domestic Suppliers (2017.12.21)
TrendForce’s latest report outlines the landscape of China’s dynamic and fast-growing semiconductor industry, and reveals that the memory segment will be a focus for the industry, considering that China now heavily relies on imported semiconductor components, and that semiconductor is a sensitive sector which may have potential applications in national security |
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Global Mobile Industry Ready to Start Full-Scale Development of 5G NR (2017.12.21)
Today the 3GPP TSG RAN Plenary Meeting in Lisbon successfully completed the first implementable 5G NR specification. AT&T, BT, China Mobile, China Telecom, China Unicom, Deutsche Telekom, Ericsson, Fujitsu, Huawei, Intel, KT Corporation, LG Electronics, LG Uplus, MediaTek, NEC, Nokia, NTT DOCOMO, Orange, Qualcomm Technologies, Inc |
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Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking (2017.12.21)
Broadcom today announced the industry’s first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeting deep learning and networking applications. Based on TSMC 7nm process technology, the platform offers best-in-class IP cores which include high speed SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells |
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UMC Announces Availability of 40nm SST Embedded Flash Process, Toshiba Expected to Utilize (2017.12.21)
HSINCHU, Taiwan - United Microelectronics Corporation today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The newly available 40nm SST process features a 20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology |
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TriLumina to Demonstrate 3D Solid-State LiDAR Using Its VCSEL Illumination Solutions at CES 2018 (2017.12.21)
At CES 2018, TriLumina will demonstrate multiple use cases for its innovative 940 nm VCSEL illumination modules, including a novel solid-state 3D LiDAR system powered by its illumination modules, which will be showcased at the company's Suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion |
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Toshiba Electronic Releases High-Current Photorelays for Factory Automation (2017.12.21)
Toshiba Electronic Devices & Storage Corporation has started to ship five new high-current photorelays in DIP4 and DIP6 packages, additions to its portfolio of photorelays incorporating MOSFETs fabricated with the latest U-MOS VIII process |
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Samsung Mass Producing Industry’s First 2nd-Gen, 10-Nanometer Class DRAM (2017.12.20)
Samsung Electronics announced today that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions |
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TrendForce Expects LED Chip Market to Achieve Supply-Demand Balance in 2018 (2017.12.20)
Major Chinese LED chip suppliers including San’an Optoelectronics and HC SemiTek have lowered their product prices recently, indicating the end of LED chip price hike that had lasted for one and a half year. According to LEDinside, a division of TrendForce, the recent price drop signals the end of LED chip undersupply, and the next year will witness a balance in LED chip supply and demand |
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Allion Labs Establishes IoT Innovation Center in Nantou, Taiwan (2017.12.20)
NANTOU, Taiwan - Standard certification and testing company Allion Labs Inc. formally opened an “IoT Innovation Center” in Zhongxing New Village, Nantou which will provide comprehensive IoT testing and certification and assist manufacturers in understanding usage scenarios in the future IoT era |
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X-FAB Introduces New Low-Power eFlash Block for Energy Harvesting & IoT Devices (2017.12.19)
X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the company’s proprietary 180 nm XH018 mixed-signal CMOS technology and are targeted at applications requiring high reliability and field re-programmability while operating at low power and in harsh environments |
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Intel Unveils Industry’s First FPGA Integrated with HBM2 (2017.12.19)
Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2).
By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to 10 times the memory bandwidth when compared with standalone DDR memory solutions |
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Public LPWA Connections to Grow at a 206% CAGR to 2021, IHS Markit Says (2017.12.19)
Globally, public low power wide area (LPWA) connections are anticipated to reach over 1 billion by 2021, according to a new report by business information provider IHS Markit. This represents a 206 percent compound annual growth rate (CAGR) from 2014 to 2021, spurred by the need for low-power wireless network technology in Internet of Things (IoT) devices |
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Sony Releases a Back-Illuminated Time-of-Flight Image Sensor (2017.12.19)
Sony Corporation today announced the release of a back-illuminated, time-of-flight ("ToF") image sensor which is 1/2-type, VGA resolution and it delivers improved depth sensing performance. Sony will start shipping sample units in April 2018 |
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AVX Releases New Vertical, Poke-Home, Wire-to-Board Connectors for Discrete 18–22AWG Wire (2017.12.18)
AVX Corporation has extended its range of vertical wire-to-board (WTB) connector solutions with the release of the new 00-9296 Series single-position, vertical, top-entry, poke-home connectors for discrete 18–22AWG solid or stranded wire |
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HOLTEK New BC32F7611 Arm Cortex-M0+ Based Low Energy Bluetooth Transparent Transmission Controller (2017.12.18)
Holtek announced the release of its new Arm Cortex-M0+ based low energy Bluetooth transparent transmission controller, the BC32F7611, a device especially developed for Bluetooth Low Energy applications. Dedicated for transparent transmission, the device is suitable for applications such as health care products, home appliances, smart device information beacons, intelligent toys and data loggers to name but a few |
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Toshiba Electronic Releases 100V N-Channel Power MOSFETs for Industrial Applications (2017.12.18)
Toshiba Electronic Devices & Storage Corporation has started to ship “TPH3R70APL” and “TPN1200APL,” new 100V additions to its low-voltage U-MOS IX-H N-channel power MOSFET series. The new devices are suitable for power supply applications in industrial equipment |
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Global Solar Photovoltaic Installations to Exceed 100 Gigawatts in 2018, IHS Markit Says (2017.12.18)
Largely driven by an improvement in the outlook in China, global photovoltaic (PV) demand is forecast to reach 108 gigawatts (GW) in 2018. According to business information provider IHS Markit strong demand from the Chinese market is expected to continue on the back of strong policy support, a successful transition to a more diverse market and strong momentum in the distributed-PV (DPV) sector |
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Innolux-Developed DST Technology Achieves Multi-Point 3D Sensing (2017.12.18)
TAIPEI, Taiwan - Taiwanese display panel manufacturer Innolux Corporation has developed Deep Sensing Technology (DST) through the use of a specialized electrode design which can even be used to operate tablet screens for sterilized gloves or thick mitts |
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Taiwan's Nanya Completes First Self-Developed 20nm 8GB DDR 4 DRAM (2017.12.18)
TAIPEI, Taiwan - Taiwanese DRAM manufacturer, Nanya Technology Corporation announced that they have completed their first independently-developed 20nm process 8GB DDR 4 DRAM, and after having obtained PC companies’ certification, they will begin shipments this month |
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