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德州儀器致力締造美好社會 擁抱多元包容價值拉近距離 (2023.01.10)
德州儀器 在台深耕 50 多年，持續透過半導體讓電子產品變得更加實惠，進而創造一個更美好的世界。除了積極發展創新解決方案外，TI 更期許成為與當地社區共好的友鄰企業 |
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能源產業成就物聯網未來？ (2017.02.02)
由於大量的智慧型電子裝置部署於變電所及配電網路，因此各界經常將能源產業視為實現IoT理所當然的機會與目標。 |
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[OSHW 2013]開放硬體運動精神：在創意，不在殺價競爭 (2013.08.13)
開放硬體運動的發展在全球科技產業中其實已有好一段時間，但對台灣來說，所謂的「開放硬體」四字，卻仍然有著一定程度的陌生感。
如果真的要說，開放硬體運動應該可以說是開放原始碼後所迎來的新一波科技浪潮 |
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-Application Response Measurement (ARM) 0.8beta1 (2008.07.31)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-.netTiers 2.2.0 (2008.05.22)
.netTiers is a set of open source code generation templates that simplify the tasks of creating customized application tiers for your Microsoft .NET applications in just a few minutes. .netTiers utilizes the power of the best |
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-Application Response Measurement (ARM) 0.7beta1 (2008.05.12)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Medea: pragmatic and simple MDA 1.0.alpha (2008.01.13)
Medea is a pragmatic code generation framework. It takes UML class and state diagrams in XMI format and uses XSLT templates to generate code for various technologies, tiers and complete applications: J2EE, CMP, Hibernate, JSP |
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-Application Response Measurement (ARM) 0.6 (2007.12.01)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Application Response Measurement (ARM) 0.4 (2006.12.09)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Cappuccino CyberCafe Cappuccino Serveur & Client (2006.11.08)
Cappuccino est un programme de gestion Cybercafe qui utilise une architecture 3-tiers, avec une DB Mysql. -Gestion des comptes prepayes. -Definition simple de la tarification. -Utilisation de la VOIP avec les postes clients. |
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-openhsm 1.1.3 (2006.05.17)
OpenHSM is policy based software for managing files. Files can be automatically backed up to tape or to a mirror filesystem. Data can be removed from files and transparently retrieved if the file is accessed. All tiers are peers, and may run policy |
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地理資訊系統面面觀 (2006.05.10)
地理資訊系統於1980年代引進台灣，透過學界逐漸在政府部門萌芽，作業平台也從高階工作站朝向個人作業系統環境；系統也從單機邁向主從架構，隨著網際網路的興起，n-tiers網路瀏覽器架構也隨之應運而生，其發展與空間圖資蒐集和製作、資訊與網路通訊技術、及應用領域的空間分析等有密不可分的關係 |
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-.NetTiers: OR mapper codesmith template 0.9.2 - Caribert (2005.11.23)
.NetTiers are CodeSmith templates for object-relational mapping that takes an existing SQLServer database and automatically generates a personnalized Data Tiers application block to use in your .Net applications. |
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-.NetTiers: OR mapper codesmith template v1 beta 1 - Clotaire (2005.07.26)
.NetTiers are CodeSmith templates for object-relational mapping that takes an existing SQLServer database and automatically generates a personnalized Data Tiers application block to use in your .Net applications. |
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Hitachi Data Systems榮獲IDC最佳「領導潮流」解決方案 (2005.06.14)
企業儲存解決方案廠商Hitachi Data Systems（HDS；Hitachi子公司）宣佈，其Hitachi TagmaStore通用儲存平台(Hitachi TagmaStore Universal Storage Platform)榮獲全球知名研究調查顧問公司IDC最新「網路儲存控制器」(NSC；Networked Storage Controller)評鑑類別中的最佳「領導潮流」解決方案 |
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多維空間晶粒堆疊世代正式來臨！ (2005.05.05)
盧超群認為，晶粒堆疊技術將是半導體產業界未來數十年的大革新，這種趨勢總稱為異質性整合，讓晶粒由原本的二度空間排列轉而成為三度空間堆疊。而鈺創這一小步也宣示了多維空間晶粒堆疊的大時代將正式來臨 |
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-openhsm 1.0.22 (2005.03.03)
OpenHSM is policy based software for managing files. Files can be automatically backed up to tape or to a mirror filesystem. Data can be removed from files and transparently retrieved if the file is accessed. All tiers are peers, and may run policy |
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細間距封裝技術發展與應用探討 (2002.10.05)
雖然覆晶技術能在電性和散熱能力能達到極佳的效能，然而在高成本與其他相關量產條件的考慮下，目前對於500至700腳數的產品而言，細間距技術仍然是優先的選擇。現階段後段的封測廠商仍然應該把握細間距封裝技術快速成長的發展潛力與可降低總體成本的優勢，在不影響電性表現的前提下，尋求突破現階段技術瓶頸的解決方案 |
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日月光發表三層鋁墊封裝技術 (2002.07.26)
日月光半導體（ASE）日前表示三層鋁墊封裝技術(Tri-tiers Wire Bonding)已開發完成，針對高I/O設計的IC充分提供了高密度、小尺寸高與低成本的產品需求服務，促使IC效能獲得更進一步的提昇 |
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十家廠商聯合發起「校園軟體先鋒專案」 (2002.03.28)
國內外軟體廠商包括倍力資訊、Sybase、以柔資訊、Leccotech、Software AG、Intershop、德勝網際、智酷科技、全華科技圖書等超過十家廠商，為縮短學校軟體教育與業界實際應用的落差，今日對外宣布聯合發起了「校園軟體先鋒專案」，會中除了展示企業級軟體發展與技術應用趨勢外，更提出校園各項專屬優惠解決方案 |
