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CTIMES / Electronic Science and Technology
Science and Technology
Allusion
Network protocols - SOAP

Full name SOAP-Simple Object Access Protocol (Simple Object Protocol) is an XML-based protocol, and its role is the compiled network services requests or responses, and then compiled message sent to the networkRoad, it simply is to transfer data between the application and the user a mechanism.
Marvell Launches Industry's First 16-Port 50GbE PHY Transceiver (2018.03.07)
Marvell announced the launch of the 88X7120, the latest offering in its Alaska C family of high-speed Ethernet physical layer (PHY) transceivers, designed to improve bandwidth and performance in the data center. The new transceiver is purpose-built to address the transition in hyperscale data centers from 25GbE (Gigabit Ethernet) and 100GbE to 50GbE
Adoption Rate of 3D Sensing in Smartphones is Estimated at 13.1% in 2018, Says TrendForce (2018.03.07)
Apple’s launch of iPhone X has led to a wave of 3D sensing technology, bringing its key component—vertical cavity surface emitting laser (VCSEL)—into the spotlight. However, the number of VCSEL suppliers with mass production capacity is very limited due to technical barriers, leading to short supply of VCSELs and thus delaying Android camp’s plan to follow suit
DFON Unveils New Serum with MMpH+ to Fight Skin Aging (2018.03.07)
DFON Biomedical Technology Inc., ITRI's first beauty care products startup, today officially marked its inauguration and unveiled a new generation of products, demonstrating how innovative technology can be applied in the development of cosmetics and skin care products
StarVR Powers Emaar Entertainment’s VR Park in Dubai (2018.03.07)
StarVR Corporation announces a major deployment of its location-based VR entertainment solution at Emaar Entertainment’s VR Park at The Dubai Mall, one of the world’s largest indoor VR theme parks. Working in tandem with Starbreeze Studios
M31 and Macroblock Work Together to Deploy the Global LED Driver IC Market (2018.03.07)
HSINCHU, Taiwan — M31 Technology Corporation and Macroblock Inc. today announced to establish their long-term partnership. Macroblock will continue adopting M31’s unique low-power IP solutions for its development of LED Driver IC to actively deploy various LED display screens and LED lighting markets in the world
Wibu-Systems’ CodeMeter Provides Secure Storage for Intel SGX Native Enclaves (2018.03.07)
Wibu-Systems, the global leader in software protection, license lifecycle management, and device security for the embedded realm, has successfully completed the Intel Software Guard Extensions (Intel SGX) enablement process for CodeMeter on Windows platforms
High-power LED Package Products in Chinese Market Saw Slight Price Drop, Says TrendForce (2018.03.06)
The prices of most LED package products in the Chinese market remained stable in February 2018, and some of the products saw slight price drop as suppliers tried to clear inventory, says LEDinside, a division of TrendForce. According to LEDinside analyst Terri Wang, a few of high-power ceramic-substrate LED package products have a slight price drop of 0
Intel, Lenovo and Diaceutics Collaborate on Development of AI Technology in Patient Care (2018.03.06)
At the Healthcare Information and Management Systems Society (HIMSS) Conference 2018, Intel unveiled a collaboration with Lenovo and Diaceutics that will allow doctors and health care providers to harness the power of artificial intelligence (AI) to transform patient diagnostic testing and improve treatment
Two New FET Drivers Benefit Aanosecond LIDAR Applications and 50-MHz DC/DC Converters (2018.03.06)
Expanding on its industry-leading gallium nitride (GaN) power portfolio, Texas Instruments (TI) announced two new high-speed GaN field-effect transistor (FET) drivers to create more efficient, higher-performing designs in speed-critical applications such as light detection and ranging (LIDAR) and 5G radio-frequency (RF) envelope tracking
Agricultural Technology Transfer to Benefit Both of Malaysia and Taiwan (2018.03.05)
TAIPEI, Taiwan - Taiwan’s Agriculture Minister Lin Tsung-hsien on March 3 visited Taiwanese businesspeople-operated companies and retailers in Kuala Lumpur that have been selling Taiwan-produced agricultural products, hoping to expand the market share of halal market and to promote Taiwan-produced fertilizer, seeds, agricultural machines in Malaysia
ASE and TDK Establish Joint Venture to Provide Wearable Chip Package Solutions (2018.03.05)
TAIPEI, Taiwan - ASE yesterday announced together with TDK the joint establishment of ASE Embedded Electronics Incorporated, and in the future they will utilize TDK-authorized SESUB technology in the production of IC embedded substrates and provide mobile and wearable device products for the semiconductor industry
HOLTEK New HT67F5652 IR Temperature Sensing MCU (2018.03.05)
Holtek announced its new IR temperature sensing application specific MCU, the HT67F5652. This new device contains a fully integrated 24-bit Delta Sigma analog to digital converter and an operational amplifier making it suitable for use in many applications that require IR temperature sensing, such as ear thermometers, forehead thermometers and so on
New 1-MHz Active Clamp Flyback Chipset and Industry-First 6-A Three-level Buck Battery Charger (2018.03.05)
Texas Instruments (TI) introduced several new power management chips that enable designers to boost efficiency and shrink power-supply and charger solution sizes for personal electronics and handheld industrial equipment. Operating at up to 1 MHz
TDK to Acquire Chirp Microsystems, Aiming for Leadership in Ultrasonic Sensing Solutions (2018.03.02)
TDK Corporation announced that it has reached an agreement with Chirp Microsystems, Inc., a pioneer in high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK. TDK expects to close the acquisition within the coming days
92 IC Wafer Fabs Closed or Repurposed From 2009-2017 (2018.03.02)
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs
Foxconn Returns to the First Place of TV OEM (2018.03.02)
TAIPEI, Taiwan - According to a survey conducted by Chinese market research institute Sigmaintell, in January 2018, the thirteen largest global television OEM manufacturers shipped out 8.02 million units, which was a yearly increase of 68
Flexible AMOLED Market More Than Tripled to $12 Billion in 2017, IHS Markit Says (2018.03.01)
Shipment revenue of flexible active-matrix organic light-emitting diode (AMOLED) displays more than tripled in 2017, accounting for 54.6 percent of total AMOLED panel shipment revenue, according to business information provider IHS Markit
Intel Introduces ‘Intel AI: In Production’ Program with AAEON (2018.03.01)
Intel unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial intelligence prototypes to market. Since its introduction last July, the Intel Movidius Neural Compute Stick (NCS) has gained a developer base in the tens of thousands
Lowest-power Multi-standard, Multi-band MCUs (2018.03.01)
To meet growing connectivity needs for buildings, factories and the grid, Texas Instruments (TI) introduced its newest SimpleLink wireless and wired microcontrollers (MCUs). These new devices offer industry-leading low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee, Bluetooth 5 and Sub-1 GHz
u-blox Announces F9 High Precision Positioning Technology for Industrial and Automotive Applications (2018.02.27)
u blox has announced the u-blox F9 technology platform, delivering high precision positioning solutions for mass market industrial and automotive applications. The platform combines multi-band Global Navigation Satellite System (GNSS) technology with dead reckoning, high precision algorithms, and compatibility with a variety of GNSS correction data services to achieve precision down to the centimeter level

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