 |
Mobile DRAM Revenues Grow Slower in 1Q18, Says TrendForce (2018.02.26)
Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%, says DRAMeXchange, a division of TrendForce. In 4Q17, the major suppliers raised their prices by 10-15% on average, driven by expected strong demand from the smartphone market during the traditional busy season, and continuing brisk demands from North American datacenters |
 |
Inova Semiconductors Announces Standalone LED Driver for In-car Lighting (2018.02.26)
Inova Semiconductors announces a new standalone smart RGB LED driver and controller, the INLC100Q16. This is the latest member of Inova’s ISELED family, a truly revolutionary concept for in-car LED lighting that substantially reduces costs, simplifies control and enables dynamically changing light |
|
NEC and KT demonstrate 5G potential in PyeongChang (2018.02.26)
NEC today announced the successful conclusion of demonstration tests of safety-related services for the 5G era in PyeongChang together with KT Corporation (KT), a leading South Korea-based communications carrier. This initiative was carried out in February 2018 based on an agreement concluded by the two companies in August 2015 to collaborate in the field of 5G networks |
|
MediaTek Unveils Helio P60, the First SoC Platform Featuring a Multi-core AI Processing Unit (2018.02.26)
MediaTek unveiled the MediaTek Helio P60 system-on-chip (SoC), the first SoC platform featuring a multi-core AI processing unit (mobile APU) and MediaTek’s NeuroPilot AI technology. Its Arm Cortex A73 and A53 processor mix delivers up to a 70 percent CPU performance boost over the Helio P23 and Helio P30, in addition to a 70 percent GPU performance enhancement |
|
Samsung Announces New 3-Stack ISOCELL Image Sensor with Integrated DRAM (2018.02.26)
Samsung Electronics today introduced the newest addition to its ISOCELL image sensor family, the 3-stack ISOCELL Fast 2L3. The 1.4-micrometer (μm) 12-megapixel (Mp) image sensor with integrated dynamic random access memory (DRAM) delivers fast data readout speeds to capture both rapid movements in super-slow motion and sharper still photographs with less noise and distortion |
|
MediaTek Joins ONNX Along with Facebook, Microsoft and Amazon to Promote AI Technologies (2018.02.26)
TAIPEI, Taiwan - MediaTek announced that they have joined “Open Neural Network Exchange (ONNX) to promote Artificial Intelligence (AI) technological innovation and the development of terminal AI platforms.
ONNX was jointly created by Amazon, Facebook, and Microsoft, all of which have shifted in the direction of creating interoperability standards for different frameworks of deep learning models |
|
Samsung Electronics Breaks Ground on New EUV Line in Hwaseong (2018.02.26)
Samsung Electronics announced that it broke ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor technology.
With this new EUV line, Samsung will be able to strengthen its leadership in the single nanometer process technology by responding to market demand from various applications |
|
AAEON to Present Its AI Edge Technology at Embedded World 2018 (2018.02.23)
AAEON will be taking part at this year’s Embedded World trade fair in Nuremburg, Germany.
The fair, which is now in its 16th year, is widely regarded as being one of the world’s most important embedded systems events. As part of its involvement at Embedded World, AAEON will showcase a number of products including Box and Panel PCs, a range of motherboards, and the UP Squared industrial innovators’ board |
|
Intel and Unigroup Spreadtrum & RDA Announce 5G Strategic Collaboration (2018.02.23)
As a core subsidiary of Tsinghua Unigroup, Unigroup Spreadtrum & RDA, and Intel Corporation officially announced a long-term strategic collaboration on 5G. The companies plan to develop a 5G smartphone platform for the China market that will feature an Intel 5G modem and will be targeted to coincide with 5G network deployments in 2019 |
|
Fingerprint Cards Launches The Third-generation Fingerprint Sensor (2018.02.22)
Fingerprint Cards Launches FPC1291, the first commercial third-generation fingerprint sensor.
The new FPC1291 is a single-chip, single-die solution, removing the need for a companion chip while maintaining and even exceeding the performance benefits of the dual-chip solution |
|
New High-Speed Optical Heart Rate Sensor (2018.02.22)
ROHM has recently announced the availability of an optical heart rate sensor for smart bands and watches capable of measuring blood pressure, stress and vascular age at a high-speed 1024Hz sampling rate. The BH1792GLC, which is ROHM's 2nd generation optical heart rate sensor, features its high accuracy and low power consumption |
|
Posiflex Showcases New Line of Touch Screen Terminals and Self-Service Kiosks at EuroCIS 2018 (2018.02.22)
TAIPEI, Taiwan - Posiflex Technology, Inc. unveils an entirely new line of dynamic touch screen terminals that embodies a new era for Posiflex and point-of-sale hardware – the RT Series. With an elegant housing and a strikingly thin profile, the RT Series brings a modern aesthetic to the counter and makes a retail business look even more attractive |
|
Integrated Circuit Technology Advances Continue to Amaze (2018.02.22)
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits |
|
Simplify Industrial-Grade Linux Designs with SAMA5D2 MPU-Based SoM (2018.02.21)
Microchip Technology has unveiled a new System on Module (SOM) featuring the SAMA5D2 MPU. The ATSAMA5D27-SOM1, which contains the recently released ATSAMA5D27C-D1G-CU System in Package (SiP), greatly simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory onto a small, single-sided Printed Circuit Board (PCB) |
|
Hon Hai to Develop Big Data, AI, and the IIoT in the Next Three Years (2018.02.21)
TAIPEI, Taipei - Foxconn Chairman Terry Guo recently stated at a Valentine's Day event that from this year to 2020, the Hon Hai Group will move in the direction of big data, artificial intelligence, and the industrial Internet as the foundations of their manufacturing industries |
|
Renesas Electronics Introduces Low-Cost Target Boards to Support Growing RX 32-bit MCU Family (2018.02.21)
Renesas Electronics today announced three new Target Boards for the RX65N, RX130 and RX231 Microcontroller (MCU) Groups, each designed to help engineers jump start their home appliance, building and industrial automation designs |
|
Seoul Semiconductor Successfully Invalidates Everlight’s Patent in the United Kingdom (2018.02.21)
On February 20, 2018, Seoul Semiconductor announced that Seoul has won the patent invalidity litigation action that was filed against Everlight Electronics Co., Ltd. (Everlight) in the United Kingdom.
Everlight’s patent, EP (UK) 1169735, which was invalidated as a result of Seoul’s suit, relates to an LED package structure for thermal dissipation |
|
Samsung Electronics Begins Mass Production of Industry’s Largest Capacity SSD – 30.72TB (2018.02.21)
Samsung Electronics announced that it has begun mass producing the industry’s largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) – the PM1643 – for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30 |
|
Acer ITS’ Smart Parking Meter Solution Takes Home the ‘Global ICT Excellence Award (2018.02.21)
Acer ITS Inc., a subsidiary of Acer, one of the world's leading ICT companies, has won the ‘Global ICT Excellence Award - Private Sector Excellence’ at the World Congress on Information Technology (WCIT) 2018 for its smart parking meter solution |
|
Acer Wins 12 iF Design Awards 2018 (2018.02.14)
TAIPEI, Taiwan - Acer today announces that it has been honored with 12 iF Design Awards 2018 in recognition for design excellence. Among them, Predator gaming device, software and packaging designs led the way for Acer with six awards including the Predator Orion 9000 desktop, Predator Triton 700 notebook, Predator X27 monitor, Predator X34P monitor, as well as PredatorSense software and Predator Gaming Gadget packaging design |
