 |
MACOM and STM to Bring GaN on Silicon to Mainstream RF Markets and Applications (2018.02.07)
MACOM Technology Solutions Holdings, Inc. and STMicroelectronics today announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications. While expanding MACOM's source of supply |
|
Innolux’s AM miniLED Panels to be Mass Produced in Two Years (2018.02.07)
TAIPEI, Taiwan - Innolux Corporation yesterday announced that their AM miniLED vehicle display panels have been selected for use in depots, and they are expected to go into mass production in two years. In addition, Innolux has also begun to develop other small and medium-sized application solutions which they plan to announce in June of this year |
 |
Iskratel Announces next-gen PON Solutions for A Cost-effective Migration (2018.02.07)
Iskratel announced two new universal next-generation PON solutions – the 8-port multi-PON blade and the 16-port GPON blade – designed to enable a lucrative and controlled upgrade to next-generation networks, such as NG-PON2 and XGS-PON |
|
Continental and NVIDIA Partner to Enable Worldwide Production of AI Self-Driving Cars (2018.02.06)
NVIDIA and Continental today announced they are partnering to create top-to-bottom AI self-driving vehicle systems built on the NVIDIA DRIVE platform, with a planned market introduction starting in 2021.
The partnership will enable the production of AI computer systems that scale from automated Level 2 features through full Level 5 self-driving capabilities, where the vehicle has no steering wheel or pedals |
|
HOLTEK New BH45B1224 Sensor Measurement A/D Converter IC (2018.02.06)
Holtek announces the release of its new sensor measurement device, the BH45B1224. This new device includes an internal 24-bit Delta Sigma A/D converter which has the characteristics of high RF noise immunity and a wide operating voltage of 2 |
|
The China Smartphone Market Declined by 4.9% in 2017 (2018.02.06)
According to preliminary data from the IDC Quarterly Mobile Phone Tracker, the China smartphone market declined 15.7% year-over-year (YoY) in 2017Q4 and 4.9% for the whole of 2017.
“In 2017, the minor upgrades that Chinese smartphone companies made to their offerings were not enough to move consumers to splurge on new models, resulting in a general slowdown in the market |
 |
Substitute Paper is the Main Objective (2018.02.05)
(圖一) E Ink Senior Director of the Product Integration Department Jim Chang.
Paper is a product that has existed in the world for 2,200 years, and it was born in the far east. Especially after undergoing improvements made in the east by Cai Lun of the Han Dynasty, paper has had an unprecedented existence and has been used by everyone everywhere |
|
u-blox Provides Cellular Connectivity for a Professional IoT Platform (2018.02.05)
u blox announced that its SARA cellular module series will provide wireless connectivity for a new end-to-end platform for Industry 4.0. With the platform, developed by Italian-based Iomote, businesses will be able to easily connect existing machines to the cloud to increase efficiency and augment their service offering |
|
N-Type Solar Cell Technologies Are Expected to Enter Mass Production in 2018, Says TrendForce (2018.02.05)
EnergyTrend, a division TrendForce, has recently published a new report Market of Advanced PV Technology. According to the report, requirements outlined in China’s Top Runner Program (3rd phase) will drive solar PV companies to improve efficiency in order to win the biddings on projects |
|
Winbond: DRAM and Flash to Remain Stable in 2018 (2018.02.05)
TAIPEI, Taiwan - Winbond on last Friday, February 2 at a legal briefing session explained that supply and demand will remain stable for DRAM and Flash in 2018 and that there will be a trend towards health and upward movement in both markets |
|
Renesas Unveils Fully Encapsulated Dual 30A and Single 33A Digital Power Modules (2018.02.02)
Renesas Electronics announced two new fully encapsulated digital DC/DC PMBus power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to 95 |
|
First LAN Transformer Manufactured 100% by Automation Now Available as a Gigabit Version (2018.02.02)
Würth Elektronik eiSos extends its WE-LAN AQ series manufactured by full automation. The new gigabit package excels with its outstanding electrical properties and compact design.
With WE-LAN AQ, the previous wound toroid cores are replaced with SMD-solderable transformers and common-mode choke elements |
|
LG Innotek Announces the First UVC Modules with IPX7 and IPX8 Housings (2018.02.02)
LG Innotek Announces the First UVC Modules with Water Resistant (IPX7) and Waterproof (IPX8) Housings
Ultraviolet beams are an efficient means of water purification or sterilization. LG Innotek, industrial partner of LASER COMPONENTS, announces the first UVC modules with water resistant (IPX7) and waterproof (IPX8) housings |
|
Mobile System on Chip Designs, Embedded Processing Lift MPU Market (2018.02.02)
The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications |
|
ASE and Cadence Deliver First System-in-Package EDA Solution (2018.02.01)
KAOHSIUNG, Taiwan - Advanced Semiconductor Engineering, Inc. and Cadence Design Systems today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages |
|
NDRC and Samsung Are Said to Be Signing MOU, which Could Moderate DRAM Price Rises, Says TrendForce (2018.02.01)
The climbing prices of DRAM over the past six quarters have added the cost pressures of Chinese smartphone brands. As the result, China’s National Development and Reform Commission (NDRC) has expressed concerns to Samsung at the end of 2017 |
|
NI and Shanghai University Collaborate on a 5G Ultra-Reliable Low-Latency Testbed for V2X (2018.01.31)
NI today announced plans to collaborate with Shanghai University on a testbed focused on 5G ultra-reliable low-latency communications (URLLC) for V2X applications.
Vehicular networks, especially for autonomous driving applications, must offer ultra-reliability while requiring very low latency |
|
SolarEdge and OMRON Launch a New DC Inverter Solution for Japan’s High-voltage PV Market (2018.01.31)
SolarEdge Technologies and OMRON Corporation are launching a new DC optimized inverter solution for Japan’s high-voltage PV market.
OMRON will offer SolarEdge's three-phase DC optimized inverter solution, consisting of inverters, power optimizers, and module-level monitoring, for the high-voltage Japanese PV market |
|
Shipments of Gaming Monitors to Grow by 40% in 2018, Says TrendForce (2018.01.31)
According to the latest report by WitsView, a division of TrendForce, the shipments of gaming monitor (with a frame rate above 100Hz) recorded about 2.5 million units in 2017, an annual growth of 80%. TrendForce forecasts that the shipments will increase by another 1 million units this year, totaling around 3 |
|
Nanowire LED Innovator Aledia Announces $36 Million Series-C Financing; Intel Capital Joins (2018.01.30)
Aledia, a developer and manufacturer of next-generation 3D LEDs for display applications based on its gallium-nitride-nanowires-on-silicon platform, today announced the closing of its Series C financing round with Intel Capital as a new investor |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.