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UMC Files Patent Infringement Lawsuit against Micron (2018.01.15)
HSINCHU, Taiwan - United Microelectronics Corporation announced that the company has filed a patent infringement lawsuit against Micron Semiconductor (Xi'an) Co., Ltd. and Micron Semiconductor (Shanghai) Co., Ltd. in the Fuzhou Intermediate People's Court of the People’s Republic of China (PRC) |
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Foundries Have Decreased the Input for LCD Driver IC in 1Q18, Says TrendForce (2018.01.15)
The expanding markets for Internet of Things, automotive electronics, and smart home devices have driven the demand for power management integrated circuit (PMIC) and microcontrollers (MCU), etc., resulting in the 200mm foundries’ less input in LCD driver ICs |
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Worldwide Semiconductor Revenue Forecast to Grow 7.5% in 2018, Gartner Says (2018.01.15)
Worldwide semiconductor revenue is forecast to total $451 billion in 2018, an increase of 7.5 percent from $419 billion in 2017, according to Gartner, Inc. This represents a near doubling of Gartner's previous estimate of 4 percent growth for 2018 |
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Samsung SDI Unveils New Battery Products at Detroit Motor Show (2018.01.15)
Samsung SDI announced that it has exhibited a brand new fast-charging, high-capacity battery material as well as cutting-edge battery products for electric vehicles at the 2018 North American International Auto Show (NAIAS).
The concept of SDI’s exhibition at the 2018 Detroit Motor Show is “Future Starts Today |
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Taiwan Establishes PCB Smart Manufacturing Alliance (2018.01.15)
TAIPEI, Taiwan - The Taiwanese government is currently promoting a policy for industrial innovation, and Advantech Co., Ltd. together with the Industrial Technology Research Institute (ITRI), Institute for Information Industry (III), Digiwin Software, Unimicron Technology Corporation, Chin Poon Industrial, Unitech, and Symtek Automation Asia Co |
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Samsung Electronics Starts Producing 8-Gigabyte HBM2 With Highest Data Transmission Speed (2018.01.11)
Samsung Electronics today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fastest data transmission speed on the market today. The new solution, Aquabolt, which is the industry’s first HBM2 to deliver a 2 |
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QLED TV and OLED TV Continue to Compete in CES, Featuring 8K Resolution (2018.01.11)
Competition between QLED TV and AMOLED TV has continued in CES this year, and resolutions of the latest TVs include both 4K and 8K specifications. Major TV brands now focus on video processing chips in addition to constant improvements of HDR (High Dynamic Range) imaging technology, says WitsView, a division of TrendForce |
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STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leader (2018.01.11)
GLOBALFOUNDRIES and STMicroelectronics today announced that ST has selected GF’s 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.
After deploying the industry’s first 28nm FD-SOI technology platform |
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Amazon Establishes Joint Innovation Center in Taiwan (2018.01.10)
TAIPEI, Taiwan - Amazon is optimistic about the talent in Taiwan and growth in demand, and these are two incentives for Amazon to partner up and establish their first flagship joint innovation center in Taiwan. On January 11, they are expected to jointly hold a briefing session on the signing of an agreement with the city government in Banqiao District, New Taipei City |
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Toshiba Electronic Unveils New-Generation 600V Planar MOSFET Series (2018.01.10)
Toshiba Electronic Devices & Storage Corporation announced the launch of “π-MOS IX,” a new series of 600V planar MOSFET. Mass production starts today.
With an optimized chip design, the π-MOS IX series provides 5dB lower peak EMI noise than the current π-MOS VII series, while maintaining the same level of efficiency |
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TI Unveils New DLP Technology for High-resolution Headlight Systems (2018.01.10)
Texas Instruments (TI) unveiled state-of-the-art DLP technology for high-resolution headlight systems at the Consumer Electronics Show (CES). The new DLP chipset is the only offering on the market that combines full programmability and the highest resolution --more than one million addressable pixels per headlight -- exceeding the resolution of existing adaptive driving beam (ADB) technologies by more than 10,000 times |
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ITRI’s Tech Showcase in AI Applications Shines at CES 2018 (2018.01.10)
HSINCHU, Taiwan - The Industrial Technology Research Institute (ITRI), Taiwan’s largest high-tech applied research institutions, demonstrated its cutting-edge R&D achievements in AI Applications at CES 2018, Las Vegas, attracting considerable attention from visitors |
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Telechips Announces Low Power 4K Set Top Box Chipset at CES 2018 (2018.01.10)
Telechips Inc. today announced their first ever 14nm finFET, system-on-a-chip (SoC) for 4K Set Top Boxes (STBs) to meet the demand of broadcast, IPTV and Over-the-top (OTT) video for operators around the world.
The latest STBs powered by the TCC899X SoC series decodes 4K video at 60 frames per second with a responsive 4K UI while handling other stringent requirements including: Dolby Vision |
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Server DRAM Prices Keep Climbing, Says TrendForce (2018.01.10)
According to the latest report of DRAMeXchange, a division of TrendForce, the price of server DRAM will continue to rise as the supply remains tight in 1Q18. Meanwhile, previous 2133MHz products will be overtaken by higher clock rate (2666MHz and 2400MHz) production, so high-bandwidth server modules will become the mainstream products |
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Alibaba A.I. Labs Announces Strategic Collaboration with MediaTek on IoT Initiatives (2018.01.10)
Alibaba A.I. Labs and MediaTek today announced a strategic collaboration in Internet of Things (IoT) initiatives including smart home protocols, customized IoT chips and AI smart hardware, with the aim of fostering the development of a connected world in the IoT era |
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STMicroelectronics Showcases its Products and Solutions for Smart Driving and the Internet of Things (2018.01.10)
STMicroelectronics is at CES 2018 in Las Vegas, Nevada, to show its latest silicon technologies and solutions for the next generation of applications in the broad IoT market and mobility platforms and services.
While many come to CES to demonstrate their latest consumer-related products |
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Micron and Intel to Complete Development of Third-gen of 3D NAND Technology (2018.01.09)
Micron and Intel today announced an update to their successful NAND memory joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.
The announcement involves the companies’ mutual agreement to work independently on future generations of 3D NAND |
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MediaTek Provides Advanced Wireless Solutions for Smart Devices in Today's Connected Homes (2018.01.09)
MediaTek today announced that global brands including ASUS, D-Link and others will use MediaTek's chipsets as they develop advanced Gigabit Wi-Fi connectivity for premium routers and whole home coverage devices.
These new devices will ensure secure, high-performance whole home wireless coverage for connected devices including PCs, smartphones, televisions and AI-powered smart home devices such as voice-enabled smart speakers |
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Intel Advances Quantum and Neuromorphic Computing Research (2018.01.09)
At the 2018 Consumer Electronics Show in Las Vegas, Intel announced two major milestones in its efforts to research and develop future computing technologies including quantum and neuromorphic computing.
Intel CEO Brian Krzanich announced the successful design, fabrication and delivery of a 49-qubit superconducting quantum test chip |
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Hitachi and Clarion Announce the "Park-by-Memory" Advanced Autonomous Parking Technology (2018.01.09)
Hitachi Automotive Systems, Ltd. and Clarion Co., Ltd. today announced the development of Park-by-Memory autonomous parking technology that remembers the environment surrounding users’ home parking spaces. Moving forward, the companies will aim for the initial adoption of this system through proposals to automotive manufacturers |
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