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Synopsys Delivers a Complete HDMI 2.1 IP Solution with HDCP 2.2 Content Protection (2017.12.01)
Synopsys announced its complete DesignWare HDMI 2.1 IP solution with High-Bandwidth Digital Content Protection (HDCP) 2.2 consisting of controllers, PHYs, verification IP, IP Prototyping Kit, and IP Subsystem as well as Linux software drivers |
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Toshiba Memory Corporation Unveils 2TB NVMe SSD (2017.11.30)
Toshiba Memory Corporation has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of the current XG5 series models and double the maximum capacity to 2TB |
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Vesper Launches High Performance VM2000 Microphone for Smart Speakers (2017.11.30)
Vesper introduced the VM2000, the only MEMS microphone that maintains high system performance over the life of a product. Targeting voice-activated systems such as smart speakers, smart home and Internet of Things (IoT) products — which use microphone arrays to enhance voice capture and clarity — the VM2000 solves a critical need for stable, reliable and accurate microphone arrays that do not degrade over time |
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Vangochip Technology Delivers Wi-SUN Certified Sub-GHz RF Platform (2017.11.29)
HSINCHU, Taiwan - Vangochip Technology today announced its first-gen sub-GHz RF family VC7000 passed the Wi-SUN Alliance PHY Certification.
Wi-SUN Alliance PHY Certification Program includes: PHY Conformance Testing based on IEEE 802 |
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DENSO and NEC Establish a JV to Develop Essential Connectivity Technologies for Cars (2017.11.29)
DENSO and NEC Platforms, Ltd., a subsidiary of NEC Corporation, today unveiled a new joint venture, DENSO NEXT CO., LTD. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles |
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Toshiba Memory Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory (2017.11.29)
Toshiba Memory Corporation started sampling Universal Flash Storage (UFS) devices utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems |
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Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (2017.11.29)
Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).
10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early) |
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Four Macronix Technical Papers Selected for 2017 IEDM (2017.11.29)
HSINCHU, Taiwan - Macronix International today announces that it has four technical papers selected for presentation at 2017 IEEE International Electron Devices Meeting (IEDM) which is taking place in San Francisco, USA from December 2-6 |
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Canadian Solar to Establish Factory in Taiwan (2017.11.29)
TAIPEI, Taiwan - Global top five solar modular manufacturer Canadian Solar will establish a factory in Taiwan, which will possibly be located in Houkou Township, Hsinchu with a production capacity of approximately 500 million watts(MW) module capacity |
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DOCOMO Develops Multi-Profile SIM for Smartphones and Tablets (2017.11.28)
NTT DOCOMO announced today that in collaboration with Gemalto, it has developed the world's first multi-profile SIM for use through multi-carrier collaborations that can allow users to switch between profiles, which include data such as contract information and telephone numbers, on their smartphone or tablet in each country |
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ASE to Enlarge High-End Packaging Plant in Kaohsiung (2017.11.28)
TAIPEI, Taiwan - The ASE Group is the largest semiconductor packaging manufacturer globally and will expand their high-end packaging production capacity in their planned Kaohsiung high-end packaging plant. Furthermore, they have already formally submitted their requirements for land to the Ministry of Economic Affairs and Kaohsiung City Government |
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Hyundai Mobis Develops Autonomous Reverse-Driving Technology (2017.11.28)
Hyundai Mobis announced that it had developed reverse driving support technology that autonomously steers when a car goes back without the driver having to operate the steering wheel.
Though there is already a function called Parking Assist (PA), which autonomously steers a car in reverse parking, this is the first time that a technology has been specifically developed to support reverse driving |
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Toshiba's New Surveillance Hard Disk Drive Series Delivers up to 10TB Capacity (2017.11.28)
Toshiba Electronic Devices & Storage Corporation announced the launch of MD06ACA-V Series of 3.5-inch hard disk drives (HDD) for surveillance applications that deliver up to 10TB of storage capacity. Sample shipments start today |
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Axiomtek’s CEM510 Has Built-in Kaby Lake Platform with Wide Operating Temperatures and 4K Graphics (2017.11.27)
Axiomtek announces the release of CEM510, its new high-performance COM Express Type 6 compact module featuring triple displays, industrial-grade wide operating temperatures and rich expansions. The CEM510 is based on the Intel Xeon E3 and 7th generation Intel Core i7/i5/i3 processors (codename: Kaby Lake-H) with Intel CM238/QM175/HM175 chipset |
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M31 Wins the Innovation Technology Award from Small Business Innovation Research (2017.11.27)
HISHCHU, Taiwan - M31 Technology Corporation received the Innovation Technology Award from Small Business Innovation Research (SBIR) Development Program of Ministry of Economic Affairs. And the award is for the M31’s innovation of "Optimization Design Flow for High-speed SoC Circuits" |
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GE and NVIDIA Join Forces to Accelerate AI Adoption in Healthcare (2017.11.27)
GE Healthcare and NVIDIA today announced they will deepen their 10-year partnership to bring the most sophisticated artificial intelligence (AI) to GE Healthcare’s 500,000 imaging devices globally and accelerate the speed at which healthcare data can be processed |
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OLED TV Remains Its Dominance in High-end Market, TrendForce Says (2017.11.27)
OLED TV and QLED TV have been competing for years, but OLED TV is expected to remain its remarkable dominance in high-end TV market in 2018, says WitsView, a division of TrendForce. More brands are expected to enter OLED TV market in 2018 with a growing field rate, and the shipments are expected to reach a new high of 2 |
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ITRI Transfers Its "Nanoparticles Monitoring Technology" to Innovative Nanotech Inc. (2017.11.24)
TAOYUAN, Taiwan - Innovative Nanotech Inc., invested by Chroma ATE Inc., signed a contract with Industrial Technology Research Institute () on Nov. 24 for "Nanoparticles Monitoring Technology" transfer. In addition, ITRI will serve as an important shareholder of Innovative Nanotech |
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STMicroelectronics Launches Open Development Platform for Secure Car-Connectivity Applications (2017.11.24)
The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles |
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Fingerprints Partners with IDEMIA to Develop a New generation of Contactless Payment Cards (2017.11.23)
Fingerprint Cards today announced its partnership with IDEMIA to develop a new generation of payment cards, the dual interface biometric card aimed at enabling seamless payment transactions without compromising security.
With IDEMIA's "F-Code" biometric authentication solution, fingerprint is the PIN |
IAB Internet Activities Board short, which means the U.S. Internet advertising organization, an agency of a dedicated management to observe the activities of the U.S. Internet advertising.