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Automotive and IoT Will Drive IC Growth Through 2021, IC Insights Says (2017.12.07)
Integrated circuit sales for automotive systems and the Internet of Things are forecast to grow 70% faster than total IC revenues between 2016 and 2021, according to IC Insights’ new 2018 Integrated Circuit Market Drivers Report |
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Complete Full-Bridge System-in-Package from STMicroelectronics (2017.12.07)
STMicroelectronics’ PWD13F60 System-in-Package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters |
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Toshiba Electronic Introduces New Bluetooth low energy IC for Automotive Applications (2017.12.06)
Toshiba Electronic Devices & Storage Corporation has announced a new IC that is compliant with Bluetooth low energy (LE) core specification 4.2 including support for secure connection, LE privacy features and extended packet length support |
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China’s IC Design Industry Revenue Grows by 22% in 2017, TrendForce Reports (2017.12.06)
According to the latest report of TrendForce, China’s IC design industry revenue will reach RMB 200.6 billion in 2017, a yearly growth of 22%. The growth rate is expected to remain at around 20%, totaling RMB 240 billion in 2018, pointed out by Cici Zhang, analyst of TrendForce |
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Smart Government Pavilion to Kick off "Smartly" at Taiwan IT Month Expo 2017 (2017.12.06)
TAIPEI, Taiwan - Taiwan is big on tech and all things digital, and best demonstrates this during its annual Information Technology Month Expo. The event will kick off on December 6 and run until December 11 in Taipei. The National Development Council expects through the exhibition to showcase five different areas in which the government has made good progress |
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Hon Hai Teams Up with Intel to Establish 5G Smart Applications in Taiwan (2017.12.06)
TAIPEI, Taiwan - The Hon Hai Group is teaming up with Asia Pacific Telecom Co., Ltd. and Intel to jointly create 5G smart applications in the following four domains: Augmented Reality (AR) and Virtual Reality(VR) lenses, medical treatment, Internet of Vehicles (IoV), and smart retail |
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STM Collaborates with Amazon Web Services on STM32-Based IoT Node-to-Cloud solution (2017.12.06)
STMicroelectronics announced today its collaboration with Amazon Web Services (AWS) on Amazon FreeRTOS, the latest addition to the AWS Internet of Things (IoT) solution, offering a complete IoT node-to-cloud solution to the market |
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BIOSTAR Unleashes Radeon RX Vega Series for 4K Gaming and Crypto Mining Pros (2017.12.05)
BIOSTAR officially releases its AMD Radeon powerful value packed graphics cards based on the RX Vega architecture – the BIOSTAR Radeon RX Vega Series: BIOSTAR Radeon RX Vega 56 (VAVAL5VM88) and top-end BIOSTAR Radeon RX Vega 64 models which is available in air-cooled edition (VAVAT5VM88) and liquid-cooled edition (VAVAX5VM88) |
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Innolux’s 100” High Brightness PID Wins Taiwan Excellence Silver Award 2017 (2017.12.05)
TAIPEI, Taiwan - Innolux’s 100-inch high brightness PID module was honored the 26th Taiwan Excellence Silver Award 2017 which is regarded as the most credible national award. Five other products, 50-inch Mega-Zone display module, 21 |
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Gen 10 and Larger Flat Panel Display Capacity to Grow at 59% CAGR to 2022, IHS Markit Says (2017.12.05)
With BOE, China Star, LG Display and Foxconn expected to build seven new Generation 10.5 factories by 2020, Gen 10 and larger fab flat panel display (FPD) capacity is expected to grow at a compound annual growth rate of 59 percent between 2017 and 2022, according to IHS Markit |
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Toshiba Launches 10TB HDD for NAS Applications (2017.12.05)
Toshiba Electronic Devices & Storage Corporation announced the addition of “MN06ACA10T,” a 10-terabyte (TB) hard disk drive (HDD) in a 3.5-inch form factor with a SATA interface. The new drive is designed for home NAS and small office/home office (SOHO) NAS applications |
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Mitsubishi and the University of Tokyo Reducing SiC Power Semiconductor Resistance by Two-Thirds (2017.12.05)
Mitsubishi Electric Corporation and the University of Tokyo announced today that they believe they are the first to quantify the impacts of three electron-scattering mechanisms for determining the resistance of silicon carbide (SiC) power semiconductor devices in power semiconductor modules |
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Samsung Starts Producing First 512GB Universal Flash Storage (2017.12.05)
Samsung Electronics today announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. Utilizing Samsung’s latest 64-layer 512-gigabit (Gb) V-NAND chips, the new 512GB eUFS package provides unparalleled storage capacity and outstanding performance for upcoming flagship smartphones and tablets |
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TSMC to Hold Supply Chain Forum This Week to Announce 7nm Manufacturing Process Schedule (2017.12.05)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) on December 7 of this week will hold a supply chain forum. It is unusual for TSMC to hold this kind of event twice in a year. At the supply chain forum this time, co-CEO Mark Liu will deliver a keynote speech, and he is expected to announce both the 7nm volume production process as well as the 5nm progress of 5nm trial production and production |
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IC Insights 2018 McClean Report and Seminar: IC Industry on Course for Improved Long-Term Growth (2017.12.05)
IC Insights believes that 2018 will see moderate growth for the IC industry and worldwide economy, with China playing a critical role in these forecasts. In 2022, the IC market is forecast to reach $460 billion, up from $364 billion in 2017 |
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Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says (2017.12.04)
The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit. Global revenue totaled $113.9 billion, up from $101 |
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World’s First Stereo-AEC Linear Far-field Voice Kit for Smart Devices (2017.12.04)
XMOS announced the XVF3500 voice processor which supports stereo-AEC, along with the world’s first stereo AEC far-field linear microphone array solution, the VocalFusion Stereo Evaluation Kit (XK-VF3500-L33).
The XVF3500 voice processor delivers 2-channel full duplex acoustic echo cancellation (AEC) |
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China's BOE Pushing Positively to Supply Its OLED Panels to Apple (2017.12.04)
TAIPEI, Taiwan - According to Economic Daily News, Beijing Oriental Enterprise (BOE), the LCD panel factory in China positively contacts with Apple, illustrating the latest progress of its OLED factory, and desire to get adopted by Apple |
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Mini LED sees Potential in Backlighting and Digital Display, TrendForce Says (2017.12.04)
LEDinside, a division of TrendForce, points out that LED manufacturers have turned to research and development of Mini LED, due to Micro LED’s technological bottlenecks which make it harder to realize commercialization in short term |
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Industrial 3D Printer Market Growing 27% in 2017, Says The Information Network (2017.12.04)
Industrial 3D printers are slated to grow 27% in 2017, lifted by sales by Hewlett-Packard, according to the Information Network, a New Tripoli-based market research company.
3D printers are segmented in this report as Industrial and Consumer |
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