 |
Toshiba Electronic Launches New Surface-Mount Brushed Motor Driver IC (2017.10.30)
Toshiba Electronic Devices & Storage Corporation has broadened its line-up of small surface-mount brushed motor drivers with the addition of “TB67H420FTG,” which supports high-voltage, large-current drive for home-use robot vacuum cleaners, printers and other office equipment |
 |
Samsung Could Increase Competition in DRAM Market Next Year, TrendForce Says (2017.10.30)
The DRAM market since then has continued to see surging prices. However, there are reports that Samsung is considering expanding its production capacity to increase competition and raise the barrier for market entry, according to DRAMeXchange, a division of TrendForce |
|
UMC Obtains LEED Gold Certification for Its Xiamen Based Fab 12X (2017.10.30)
HSINCHU, Taiwan - United Microelectronics Corporation today announced that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership in Energy and Environmental Design) Gold recognition from the U.S. Green Building Council |
|
Facial Recognition Reinforces Physical Retailers' Advantages and Reduces Disadvantages, MIC Says (2017.10.30)
The progress in innovation and technology is redefining the retail industry which has undergone continuous transformation. Networks, mobile platforms, social media, and live shopping have changed consumers' shopping habits, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
|
Taiwan’s Apple Supply Chains Heat Up for Upsurge of iPhone X Pre-orders (2017.10.30)
TAIPEI, Taiwan - According to a Taiwan Economic Daily News report, because pre-orders of the iPhone X have exceeded expectations, Apple has urgently requested assistance from related supply chains in Taiwan.
Currently in addition to be a hot selling item for pre-order in the American market, pre-orders have also exceeded expectations in the greater China region in Asia |
|
HERE and Mitsubishi Electric Team up to Offer Advanced Location Services for Autonomous Cars (2017.10.30)
HERE Technologies and Mitsubishi Electric Corporation announced their intention to link their technologies for autonomous vehicles into a powerful integrated offering for automakers.
According to their preliminary agreement, the companies aim to offer services to support cars with ADAS (advanced driver assistance systems) on the road today right through to the fully autonomous vehicles of the future |
|
Taiwanese Brands to Showcase Their Latest Automobile Technology at AAPEX 2017 (2017.10.30)
Taiwan’s leading auto parts brands will showcase their latest automobile technology at the Taiwan Excellence Pavilion at AAPEX 2017, being held October 31-November 2 at the Sands Expo in Las Vegas, Nevada.
With the increasing importance of telematics and vehicle safety issues, Taiwan is leveraging its outstanding ICT technology and is ready to provide superior quality solutions for global buyers |
|
VIA Launches VIA SOM-9X20 Featuring Qualcomm Snapdragon 820 Embedded Platform (2017.10.26)
TAIPEI, Taiwan - VIA Technologies, Inc., today announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm Snapdragon 820 embedded platform.
The VIA SOM-9X20 is an ultra-compact SoM that harnesse |
|
congatec Presents Virtualized Fog Server Installation (2017.10.26)
congatec will be presenting its first robust, fanless, virtualized edge server platform for the extended temperature range at Embedded Conference Scandinavia (ECS) to be held in Stockholm from 7-9 November.
The platform supports redundancy as well as real-time collaboration and consists of COM Express Type 7 modules with Intel Atom processors (codename Denverton) and a real-time hypervisor from Real-Time Systems |
|
Vishay Intertechnology High Speed PIN Photodiodes Enable Slim Sensor Designs for Wearables (2017.10.26)
Vishay Intertechnology broadens its optoelectronics portfolio with the introduction of two new high speed silicon PIN photodiodes that deliver enhanced sensitivity for visible light.
Featuring infrared radiation suppression filters and black packages for an improved signal-to-noise ratio, the Vishay Semiconductors VEMD5510C and VEMD5510CF offer fast switching times and low capacitance in compact top-view, surface-mount packages |
|
Winbond Introduces TrustME Secure Flash Memory Implementing the TCG DICE Architecture (2017.10.26)
TAICHUNG, Taiwan - Winbond Electronics Corporation today announced an expansion of its TrustME Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification |
|
NVIDIA, Taiwan’s MOST to Accelerate Taiwan AI Revolution (2017.10.26)
NVIDIA today announced that it is collaborating with Taiwan’s Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan’s commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries |
|
IPS Display Adoption in Notebook PCs Continues to Increase, IHS Markit Says (2017.10.26)
Display shipments for notebook PCs are forecast to increase by 5 percent in 2017 to 177 million units compared to the previous year, while notebook PC unit shipments are expected to remain flat during the same period. Being worried about slower shipments next year due to higher inventory, panel makers are focusing on expanding high-end displays, such as in-plane switching (IPS) technology and low-power consuming displays |
|
Taiwan's NAR Labs and Synopsys Sign LOI for AI Technology Cooperation (2017.10.25)
TAIPEI, Taiwan - Taiwan's National Applied Research Laboratories (NAR Labs) and semiconductor design and software company Synopsys, Inc. have signed a letter of intent for AI technology cooperation to carry out mutual collaborations on key Artificial Intelligence (AI) technologies |
|
Portwell Announces PICO-6260 PICO-ITX Form Factor Embedded System Board (2017.10.25)
Portwell announces the release of the PICO-6260 (100mm x 72mm) Pico-ITX embedded system board based on the Intel Atom processor E3900 series and Intel Celeron processor N3350, formerly codenamed Apollo Lake.
The Intel Atom processor E3900 series and Intel Celeron processor N3350 integrates the Intel Gen 9 3D graphics engine with up to 12 EUs (Execution Units) that improves performance and supports 4K codec encoding/decoding |
|
Connected IoT Devices Will Surge to 125 Billion Units by 2030, IHS Markit Says (2017.10.25)
The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.
In a new free ebook entitled “The Internet of Things: a movement |
|
DENSO Develops World's Largest Automotive Head-up Display (2017.10.25)
DENSO today announced it has developed a thin-film transistor (TFT), liquid-crystal head-up display (HUD) to project critical driving information onto the windshield for drivers. This human machine interface (HMI) is the world's largest automotive head-up display with a nearly 24-inch projection |
|
ITRI Holds MEDiT Forum to Boost Innovation in Taiwan’s Medical Electronics (2017.10.25)
TAIPEI, Taiwan - Themed with "Multi-disciplinary Innovations in Healthcare”, the Medical Electronics and Device in Taiwan (MEDiT) Forum 2017 took place on October 25 and 26. This year’s forum invited participants such as Fujitsu, Advantech, and Qisda to share smart biomedical technology and market trends |
|
TI Introduces New LLC Controller Enables the Lowest Standby Power (2017.10.24)
Texas Instruments (TI) introduced a new inductor-inductor-capacitor (LLC) resonant controller with an integrated high-voltage gate driver that enables the industry's lowest standby power, as well as longer system lifetimes.
The UCC256301 provides a cost-effective system solution that helps meet stringent energy-efficiency standards for a wide range of AC/DC applications |
|
WLP Device Shipments to Overtake Flip Chip in 2018, Says Information Network (2017.10.24)
The number of IC packages utilizing WLP will overtake Flip Chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for Flip Chip, according to the Information Network |
