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Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC (2017.11.16)
Cypress Semiconductor and United Microelectronics Corporation today announced that Cypress’ 65nm and 40nm technology platforms are the industry’s first to achieve Qualified Manufacturers List (QML) certification for their advance product flows |
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Korean Quake on Nov. 15 Doesn't Influence Panel Industry Much, Says TrendForce (2017.11.16)
At 2:29 p.m. on November 15 of South Korea's local time (1:29 p.m. of Taiwan's local time), a 5.5-magnitude shock struck Korea's east coast. The epic center is located at 9 kilometers north to Pohang City, North Gyeongsang Province |
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Taiwan IC Revenue Totaled NT$642.8 billion, 12.3% Growth on-Quarter (2017.11.16)
According to the TSIA’s survey, Q3 2017 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$642.8 billion(US$21.2B), 12.3% growth on-quarter and down 2.5% on-year.
Separately, NT$165 |
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Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process (2017.11.16)
HSINCHU, Taiwan - Faraday Technology Corporation today introduced its M1+ standard cell library on UMC 28HPC process. Library routability is always a major concern for back-end layout engineers at advanced process technologies |
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Do More and Consume Less with New STM32L4+ MCUs Series (2017.11.16)
The smart electronic objects people interact with every day can be easier to use and run for longer on batteries when designed around the latest ultra-low-power microcontrollers from STMicroelectronics.
The new STM32L4+ devices -- a new generation of the STM32L4 series that stretches performance to 150DMIPS (233 ULPMark-CP) at 120MHz -- can act as the central controller in a full range of fitness bands |
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Seoul Semiconductor Introduces a Acrich Based Compact LED Driver with 5X the Power Density (2017.11.15)
Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers. Based on Seoul Semiconductor’s patented Acrich technology, the MicroDriver Series delivers more than 24W of output power with a power density of 20W/cubic inch cubic inch, compared to existing drivers at 3-5W/cubic inch |
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Holtek Announces Intelligent Fire Alarm MCU SIP Module Integrated with Semtech’s LoRa (2017.11.15)
Holtek has announced today that they are collaborating with Semtech Corporation to develop a new smart fire alarm module integrated with Semtech’s LoRa devices and wireless RF technology (LoRa Technology) and leveraging LoRaWAN, the open protocol |
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0.7% YoY Growth beyond Expectation for 2017 Notebook Shipments, TrendForce Reports (2017.11.15)
Market research firm TrendForce reports that the global notebook shipments for this third quarter registered a remarkable quarterly increase of 6.8% and a year-on-year increase of 0.9%, reaching 42.69 million units. The overall performance of notebook shipments brought by peak season exceeded the previous expectations |
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Toshiba Releases 1.5A LDO Regulators in Industry's Smallest Package for Mobile Applications (2017.11.15)
Toshiba Electronic Devices & Storage Corporation has started shipping “TCR15AG,” a low-dropout (LDO) regulator series in the industry’s smallest WCSP6F package. The TCR15AG series is suitable for mobile and modular applications requiring small, thin devices |
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NEC Launches LoRaWAN Compliant Network Server (2017.11.15)
NEC Corporation today announced the global commercialization of a new network server that complies with LoRa (Long Range) WAN, a new wireless communication technology, and LPWA (Low Power Wide Area), which creates wide area networks with low power consumption |
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Chinese AI Pioneer YITU Announces Plan to Establish R&D Hub in Singapore to Accelerate AI Developmen (2017.11.15)
YITU Technology announced its plans to set up a Research & Development (R&D) Hub in Singapore, bolstering Singapore's AI applications in the area of security and finance. The discussion was held at a visit to YITU's Shanghai headquarters recently, represented by Singapore officials from the Ministry of Home Affairs (MHA) and Singapore's Economic Development Board (EDB), where they witnessed its award-winning facial recognition technologies |
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China's GigaDevice Is Expanding NOR Flash Chip Production Capacity (2017.11.14)
TAIPEI, Taiwan - The whole world is hard pressed for coded Flash memory (NOR Flash), and the appearance of new variables in this situation is possible. Mainland Chinese NOR chip provider GigaDevice have obtained assistance from SMIC and are currently expanding their NOR Flash production capacity |
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Flexible AMOLED Panel Supply Capacity to Exceed Demand by 44% in 2018, IHS Markit Says (2017.11.14)
With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit |
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Intel and Micron Increase 3D XPoint Manufacturing Capacity with IM Flash Fab Expansion (2017.11.14)
Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah.
The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series |
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Huawei and Gemalto Team Up to Accelerate NarrowBand IoT Deployments (2017.11.14)
Gemalto and Huawei - via its semiconductor arm, HiSilicon - are working together to develop the next generation of modules that combine an extra level of security and consume very low power.
NB IoT has been developed to address lower bit rates and lower cost segments, and works virtually anywhere |
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TrendForce Reports 3Q17 DRAM Revenue Hit a New High With a 16.2% Sequential Increase (2017.11.13)
Revenue of the entire global DRAM industry climbed to a new historic high for the third quarter of 2017, reports DRAMeXchange, a division of TrendForce. Contract prices of various DRAM products jumped by about 5% on average in the third quarter from the second quarter on the back of the year-end busy season and limited bit supply growth |
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Acer Launches High-Performance Inference Accelerated Multi-Node Server (2017.11.13)
Acer announced its new Altos W2200h-W670h F4 high-density multi-node server ahead of the SC17 supercomputing conference in Denver. With a 2U rack-mountable form factor supporting four front-access compute nodes, it is ideal for high-performance computing, deep learning and in-memory database applications with compute-intensive and memory-intensive workloads |
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Face Detection Accounts for Major Share of Apple's Patents with Most Recognition Technologies (2017.11.13)
Apple's facial recognition patents, consisting of face detection (including image pre-processing) and recognition (including feature extraction), account for 45% of its granted patents, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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Intel Doubles Capacity of Its Optane Data Center SSD (2017.11.13)
Intel announced the Intel Optane SSD DC P4800X Series is now available in a new 750GB capacity in both half-height, half-length add-in card and a hot-swappable 2.5-inch U.2 form factor. Both form factors and capacities will be broadly available this month |
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China Telecom and TransTeleCom Launch the First 100G Link Between Asia and Europe (2017.11.13)
China Telecom and TransTeleCom have developed the first transit telecommunication route connecting China and Europe based on100G ULH (Ultra Long Haul) DWDM technology. As part of the project, the companies have constructed a new 100Gbps gateway interface on the border between the two countries, the Chinese city of Manzhouli and in the Russian city of Zabaikalsk |
