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Veeco and ALLOS Demonstrate 200mm GaN-on-Si Wafers for micro-LED Production (2017.11.02)
Veeco Instruments Inc. announced the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production. Veeco teamed up with ALLOS to transfer their proprietary epitaxy technology onto the Propel Single-Wafer MOCVD System to enable micro-LED production on existing silicon production lines |
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Ultra-Low ICs With an Integrated Schottky Diode Bridge and LDO Regulator XCM414 Series (2017.11.01)
Torex Semiconductor Ltd. has launched multichip-module power ICs that integrate four Schottky diodes and an LDO regulator.
With the increase in recent years of smartcards and other products that are equipped with a thin lithium ion battery or super capacitor, a demand for simple wireless charging has emerged |
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Global Branded TV Shipments to Drop by 4.2% Annually for 2017, TrendForce Says (2017.11.01)
WitsView, a division of TrendForce, reports that the global shipments of branded TV sets for the third quarter of 2017 totaled 54.99 million units, showing an increase of 16% from the second quarter and a year-on-year decline of 4 |
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Sony Announces Its New "aibo" Autonomous Robot (2017.11.01)
Sony Corporation today announced "aibo" the evolution of its autonomous entertainment robot. aibo can form an emotional bond with members of the household while providing them with love, affection, and the joy of nurturing and raising a companion |
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Hikvision Introduces Its AI Cloud Platform (2017.11.01)
Hikvision held an Artificial Intelligence forum in Shenzhen, China on October 28, where Hikvision introduced its AI Cloud, the next level of AI technology development, and its comprehensive implementation in a variety of vertical applications |
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Renesas to Set Up New Energy Vehicle Solution Center to Accelerate Efforts in the Chinese EV Marke (2017.11.01)
Renesas Electronics Corporation today announced it will establish a “New Energy Vehicle Solution Center” on November 1, 2017, directly under the China Business Unit to accelerate engagement with the Chinese new energy vehicle (NEV) market |
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TAICS and ARIB Jointly to Boost 5G-era Smartphone Services in Taiwan (2017.10.31)
TAIPEI, Taiwan – Taiwan Association of Information and Communication Standards (TAICS) and Association of Radio Industries and Businesses (ARIB) today organized jointly the “5G-era Smartphone Application and Service Workshop” in Taipei, Taiwan |
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Sensors, Actuators and Discretes IC to Set Record-high Annual Sales This Year (2017.10.31)
More than a dozen product categories in optoelectronics, sensors and actuators, and discretes semiconductors (O-S-D) are on track to set record-high annual sales this year, according to a new update of IC Insights’ 2017 O-S-D Report |
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U.S. Semiconductor Chemical Suppliers Lost Market Share Over Past Decade (2017.10.31)
U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to the Information Network, a New Tripoli, PA-based market research company.
“Despite a shift in semiconductor manufacturing from the U |
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USB Smart Hub ICs Enable Smartphone-Connected Automotive Infotainment (2017.10.31)
Microchip Technology provides unrivaled options with its five new USB 2.0 smart hub ICs. These devices, available in a variety of architectures, offer greatly increased flexibility to fit car manufacturers’ design needs and meet consumer demand for easy-to-use, intuitive systems |
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Toshiba Electronic Launches New Surface-Mount Brushed Motor Driver IC (2017.10.30)
Toshiba Electronic Devices & Storage Corporation has broadened its line-up of small surface-mount brushed motor drivers with the addition of “TB67H420FTG,” which supports high-voltage, large-current drive for home-use robot vacuum cleaners, printers and other office equipment |
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Samsung Could Increase Competition in DRAM Market Next Year, TrendForce Says (2017.10.30)
The DRAM market since then has continued to see surging prices. However, there are reports that Samsung is considering expanding its production capacity to increase competition and raise the barrier for market entry, according to DRAMeXchange, a division of TrendForce |
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UMC Obtains LEED Gold Certification for Its Xiamen Based Fab 12X (2017.10.30)
HSINCHU, Taiwan - United Microelectronics Corporation today announced that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership in Energy and Environmental Design) Gold recognition from the U.S. Green Building Council |
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Facial Recognition Reinforces Physical Retailers' Advantages and Reduces Disadvantages, MIC Says (2017.10.30)
The progress in innovation and technology is redefining the retail industry which has undergone continuous transformation. Networks, mobile platforms, social media, and live shopping have changed consumers' shopping habits, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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Taiwan’s Apple Supply Chains Heat Up for Upsurge of iPhone X Pre-orders (2017.10.30)
TAIPEI, Taiwan - According to a Taiwan Economic Daily News report, because pre-orders of the iPhone X have exceeded expectations, Apple has urgently requested assistance from related supply chains in Taiwan.
Currently in addition to be a hot selling item for pre-order in the American market, pre-orders have also exceeded expectations in the greater China region in Asia |
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HERE and Mitsubishi Electric Team up to Offer Advanced Location Services for Autonomous Cars (2017.10.30)
HERE Technologies and Mitsubishi Electric Corporation announced their intention to link their technologies for autonomous vehicles into a powerful integrated offering for automakers.
According to their preliminary agreement, the companies aim to offer services to support cars with ADAS (advanced driver assistance systems) on the road today right through to the fully autonomous vehicles of the future |
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Taiwanese Brands to Showcase Their Latest Automobile Technology at AAPEX 2017 (2017.10.30)
Taiwan’s leading auto parts brands will showcase their latest automobile technology at the Taiwan Excellence Pavilion at AAPEX 2017, being held October 31-November 2 at the Sands Expo in Las Vegas, Nevada.
With the increasing importance of telematics and vehicle safety issues, Taiwan is leveraging its outstanding ICT technology and is ready to provide superior quality solutions for global buyers |
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VIA Launches VIA SOM-9X20 Featuring Qualcomm Snapdragon 820 Embedded Platform (2017.10.26)
TAIPEI, Taiwan - VIA Technologies, Inc., today announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm Snapdragon 820 embedded platform.
The VIA SOM-9X20 is an ultra-compact SoM that harnesse |
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congatec Presents Virtualized Fog Server Installation (2017.10.26)
congatec will be presenting its first robust, fanless, virtualized edge server platform for the extended temperature range at Embedded Conference Scandinavia (ECS) to be held in Stockholm from 7-9 November.
The platform supports redundancy as well as real-time collaboration and consists of COM Express Type 7 modules with Intel Atom processors (codename Denverton) and a real-time hypervisor from Real-Time Systems |
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Vishay Intertechnology High Speed PIN Photodiodes Enable Slim Sensor Designs for Wearables (2017.10.26)
Vishay Intertechnology broadens its optoelectronics portfolio with the introduction of two new high speed silicon PIN photodiodes that deliver enhanced sensitivity for visible light.
Featuring infrared radiation suppression filters and black packages for an improved signal-to-noise ratio, the Vishay Semiconductors VEMD5510C and VEMD5510CF offer fast switching times and low capacitance in compact top-view, surface-mount packages |
