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AMBER Wireless Presents Its Design kit for Raspberry Pi: AMBER PI (2017.09.26)
AMBER wireless GmbH offers a design kit with which developers can realize applications for wireless connection in the sub-GHz band. AMBER PI is a plug-on board for the Raspberry Pi 3B. Besides the power-saving sub-GHz wireless interface from AMBER wireless, the board is equipped with integrated sensors for temperature, humidity, air pressure and movement |
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Accelerating IoT Development with Axiomtek’s IIoT Gateway： ICO300-83B (2017.09.26)
Axiomtek has announced the ICO300-83B, a rugged DIN-rail fanless embedded system powered by the low-power consumption Intel Celeron processor N3350 (Formerly codename: Apollo Lake). The DIN-rail industrial IoT gateway featuring reliable operation, sufficient storage, and rich I/O options is an ideal solution for smart energy and smart automation fields |
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Toshiba Launches 10-terabyte Enterprise Capacity HDD (2017.09.26)
Toshiba Electronic Devices & Storage Corporation announced the addition of an 10-terabyte (TB) SATA model to its MG06 series of 3.5-inch, enterprise capacity class hard disk drives (HDD). Shipments start from today.
The continuing progress of digitization |
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Taiwan’s CPT Successful Lights QLED Display Technology (2017.09.26)
TAIPEI, Taiwan - AMOLED self-illuminating display panels have been pushed to the limit of thinness and have become the top choice for high-end display panels on mobile devices. However, this technology is now faced with a new contender |
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Broadcom Introduces World’s First Dual Frequency GNSS Receiver (2017.09.25)
Broadcom Limited announced the world’s first mass-market, dual frequency GNSS receiver device, the BCM47755, designed to enhance location based services (LBS) applications for mobile phones, tablets and fitness wearables.
Equipped with the latest GNSS innovations |
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Intel Unveils the 8th Gen Intel Core Processor Family for Desktop Featuring Best Gaming Ability (2017.09.25)
Intel today announced that its new family of 8th Gen Intel Core desktop processors will be available for purchase beginning Oct. 5, 2017.
The new desktop processor family is built for gamers, content creators and overclockers who require premium performance |
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HOLTEK New BA45F0082/BA45FH0082 Fire Protection Application MCUs (2017.09.25)
Holtek announces the release of its new low power consumption fire protection application Flash MCU series, the BA45F0082 and the BA45FH0082. These devices will find excellent use in fire protection peripheral product applications such as independent temperature detecting alarms, Input/Output modules, temperature detectors, electrical fire detectors, acousto-optical alarms, fire door monitoring in addition to many others |
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New High Speed Signal Transmission Photorelays From Toshiba with Industry's Smallest Footprint (2017.09.25)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced the launch of two high speed signal transmission photorelays, “TLP3475S” and “TLP3440S,” that realize the industry’s smallest footprint. Shipments start today |
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RTI and NEC Announce the SEA-US Submarine Cable Is Ready for Commercial Service (2017.09.25)
RAM Telecom International, Inc. (RTI) and NEC Corporation announced that the Southeast Asia - United States Cable System (SEA-US) is ready for commercial service following acceptance by the SEA-US consortium, and that construction has commenced on the Hong Kong - Guam Cable System (HK-G) extension |
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North American Semiconductor Equipment Industry Posts $2.18B in Billings in August (2017.09.25)
North American Semiconductor Equipment Industry Posts $2.18B in Billings in August
North America-based manufacturers of semiconductor equipment posted $2.18 billion in billings worldwide in August 2017 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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Over 30% of Smartphones Shipped in 2018 to Carry OLED Panel as iPhone X Revealed, TrendForce Says (2017.09.22)
WitsView, a division of TrendForce, anticipates OLED’s representation in the smartphone market will increase substantially following the release of iPhone X. With Apple expected to support this display technology in the future, the percentage of OLED models in the total annual smartphone shipments worldwide is projected to climb from 28% this year to 33% in 2018 |
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ASUS Announces ZenFone 4 Family in Europe (2017.09.22)
Today, in Rome, ASUS CEO Jerry Shen unveiled the ZenFone 4 smartphones — ZenFone 4 Pro with gigabit connectivity, ZenFone 4, ZenFone 4 Selfie Pro, ZenFone 4 Selfie and ZenFone 4 Max — during the We Love Photo press event. ZenFone 4 is the first family of smartphones to all feature dual rear or dual front cameras, enabling users to capture the best photos in any scenario, at any distance, and in any lighting conditions |
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Toshiba Machine Opens New Technical Center for Machine Tools in Gotemba Plant (2017.09.22)
Toshiba Machine announced the opening of a new technical center for machine tools in its Gotemba plant in Japan that incorporates numerous features for developing machine tool businesses. The Technical Center conducts test ma |
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Mitsubishi Electric Develops SiC Power Device with Record Power Efficienc (2017.09.22)
Mitsubishi Electric Corporation announced that it has developed a silicon carbide (SiC) power device with what is believed to be the world’s highest power efficiency in a device of its type.
The newly-developed unit is designed to be installed in power modules, and does not require a high-speed protection circuit to interrupt supply when excess current is detected |
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New Camera and Display Mirrors Enhance Vehicle Safety and Fuel Efficiency, IHS Markit Says (2017.09.21)
Rear-view and side-view mirrors on new vehicles will begin to see major changes over the next decade, according to new analysis from business information provider IHS Markit. Combining high-definition cameras and displays in place of – or to complement – traditional mirror designs offers a compelling case for automakers to improve on fuel efficiency and battery range |
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Toshiba Storage Launches Photocoupler with UVLO Function (2017.09.21)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced the launch of “TLP2735,” a high speed IC photocoupler for MOSFET gate signal insulation and the company’s first to incorporate an under voltage lockout (UVLO) function |
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Toshiba Memory to Focus on Catching Up to Samsung in 3D-NAND Production Capacity (2017.09.21)
According to DRAMeXchange, a division of TrendForce, the Toshiba Memory Corporation (TMC) deal will start to have a notable impact on the NAND Flash market in the first half of 2018 as the negotiations took longer than expected |
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Holtek Semiconductor 2017 New Product Presentation to Address Wireless and Intelligent Life (2017.09.21)
Holtek Semiconductor's Taiwan and Mainland China New Product Presentation tour will this year take place between October 12 and November 2. The first seminar kicks-off on October 12 at the Ambassador Hotel in Taipei.
As the combination of home life |
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APeJ 3D Printer Market Jumped to 106% Growth in 2016, IDC Says (2017.09.21)
The latest results from the Asia/Pacific (Excluding Japan) 3D Printer Forecast, 2017–2021 reveals 3D printer shipments in the Asia/Pacific excluding Japan (APeJ) grew by almost 106% in 2016 compared to 2015. China remains the major growth driver in the region after hitting 122% shipment growth rate in 2016 |
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The Industry’s First External CAN Flexible Data Rate Controller (2017.09.20)
The industry’s first external CAN Flexible Data Rate (CAN FD) controller is now available from Microchip Technology. The MCP2517FD allows designers a simplified path to upgrade from CAN 2.0 to CAN FD and benefit from CAN FD protocol enhancements
CAN FD offers many benefits over traditional CAN 2 |
