Account:
Password:
 
CTIMES / Electronics industry
Science and Technology
Allusion
P2P-file exchange

"P2P", it simply is peer-to-peer-to peer-to-peer connection software ", which means" the use of the end "" Using end "(Client to Client) communications technology that allows all devices without going through the centralserver, will be able to directly Unicom spread information.
TrendForce Maintains 4Q17 NAND Flash Market Outlook After Toshiba’s Capacity Rumors (2017.10.17)
Despite lower-than-expected output caused by certain problems in production lines, Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange, a division of TrendForce
Mitsubishi Electric Field Testing xAUTO Autonomous-Driving Test Vehicle (2017.10.17)
Mitsubishi Electric Corporation announced today that it has been conducting expressway-based field testing of its xAUTO vehicle and related autonomous-driving technologies for self-sensing and network-based driving, since May 2016
AUO Delivers All-Round Solar Power Plants Ranging from Rooftop, Ground Mount and Floating Types (2017.10.17)
HSINCHU, Taiwan – In response to the Taiwan government’s “2-Year Solar Power Promotion Plan", AU Optronics Corp. (AUO) has been continuously accelerating its pace in developing solar power systems in recent years. In addition to focusing on rooftop solar power plants, the Company has extended its reach to the ground mount and floating solar power markets to demonstrate its comprehensive capability for solar power plant development
40VIN, 2A Silent Switcher µModule Regulator in 6.25mm x 4mm BGA Package (2017.10.16)
Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM8063, a 40VIN, 2A µModule step-down regulator in a tiny 6.25mm x 4mm BGA package. The package size is 75% smaller than the existing equivalent product
Mitsubishi Electric Unveils EMIRAI 4 Smart Mobility Concept Car (2017.10.16)
Mitsubishi Electric Corporation today unveiled its EMIRAI 4 concept car featuring next-generation driving-assistance technology, which is expected to help reduce traffic accidents and contribute to increasingly safe, convenient and environmentally friendly transportation
BIOSTAR Launches Flagship RACING Z370GT7 for Intel’s 8th Gen Core Desktop CPUs (2017.10.16)
BIOSTAR introduces its flagship Intel Z370 motherboard under the third generation RACING series, the BIOSTAR RACING Z370GT7. This motherboard supports the latest 8th generation Intel Core processors also known as Coffee Lake. The RACING Z370GT7 sports premium features that gamers, overclockers, professional content creators, and modders demand
Smart Application Trends are Significant – Holtek Promotes 32-bit MCU Products (2017.10.16)
TAIPEI, Taiwan - Internet of Things (IoT) and smart trends continue to drive the growth of microcontroller (MCU) chips with both the vastness of applications and performance simultaneously experiencing rapid growth. MCU chip provider Holtek Semiconductor today at a yearly presentation for new products launched several types of 32-bit MCU products with applications that include wireless charging
ST Cooperates with Alibaba Cloud to Provide Cloud-to-node IoT Solution to the Market (2017.10.16)
STMicroelectronics announced its cooperation with Alibaba Cloud to provide a complete cloud-to-node IoT solution to the market. The cooperation will allow any designer to easily create IoT nodes and gateways using ST's key semiconductor building blocks for the IoT, run Alibaba's IoT operating system AliOS on the node, and seamlessly connect with the Alibaba Cloud for faster time-to-market of large-volume IoT applications
300mm Wafer Fabs Expected to Increase Each Year by 2021, IC Insights Says (2017.10.13)
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm wafer production-class fabs in operation worldwide is expected to increase each year between now and 2021 to reach 123 compared to 98 in 2016, according to the forecast in IC Insights
Acer Wins Eight 2017 Good Design Awards (2017.10.13)
TAIPEI, Taiwan – Acer announced today that eight of its products have been honored with a 2017 Good Design Award for outstanding product design. The award-winning Acer products include a 360-degree camera, 360-degree dash cam, indoor air quality monitor, all-in-one desktop PC, and four notebooks
Spirent and China Mobile Partner to Run the 5G C-RAN Project (2017.10.12)
Spirent Communications announced today it has signed an agreement to partner with the China Mobile 5G Joint Innovation Center Project. As part of the first phase of the 5G C-RAN project, Spirent and the China Mobile 5G C-RAN Working Group successfully completed automated performance testing
Worldwide Semiconductor Revenue to Reach $411 Billion in 2017, Gartner Says (2017.10.12)
Worldwide semiconductor revenue is forecast to total $411.1 billion in 2017, an increase of 19.7 percent from 2016, according to Gartner, Inc. This represents the strongest growth since the 2010 recovery from the financial crisis when revenue increased by 31
Mobile DRAM Prices to Go Up by 10~15% in 4Q17, Says TrendForce (2017.10.12)
DRAMeXchange, a division of TrendForce, estimates that mobile (LPDDR) DRAM products will see sequentially quarterly price increases in the average range of 10~15% in the fourth quarter of 2017. This price hike is attributed to DRAM suppliers seeking to correct price differences among various applications as well as the year-end busy season in the smartphone market
Silicon Labs Introduces USB Type-C Rechargeable Battery Packs (2017.10.11)
Silicon Labs has introduced a comprehensive reference design to simplify the development of USB Type-C rechargeable lithium ion battery packs used to power smartphones, tablets, laptops, headphones and other portable devices. The reference design includes everything developers need to create dual-role port (DRP) applications with USB Type-C power delivery (PD)
TYAN Exhibits NVIDIA Tesla V100 GPU Powered Server Platforms for HPC and AI at GTC Europe 2017 (2017.10.11)
TYAN, the subsidiary of MITAC Computing Technology Corporation, showcases their latest GPU-optimized platforms that target the high performance computing and artificial intelligence sectors at the GPU Technology Conference in Munich, Germany during Oct 10~12
Toshiba Memory to Further Invest in Production Equipment for Fab 6 at Yokkaichi Operations (2017.10.11)
Toshiba Corporation today announced that its board of directors has approved a further investment by Toshiba Memory Corporation (TMC), a wholly-owned subsidiary that manufactures Flash memory, in manufacturing equipment for the Fab 6 clean room under construction at Yokkaichi Operations
Samsung Introduced New ISOCELL Image Sensors with Dual Pixel Technology (2017.10.11)
Samsung Electronics introduced two new ISOCELL image sensors: 1.28-micrometer (μm) 12-megapixel (Mp) ISOCELL Fast 2L9 with Dual Pixel technology, and ultra-small 0.9μm 24Mp ISOCELL Slim 2X7 with Tetracell technology. Samsung ISOCELL image sensors fall into four categories—Fast, Slim, Bright and Dual—depending on their key attributes
Traditional Promotions Are No Longer an Effective Growth Driver of PC (2017.10.11)
Worldwide PC shipments totaled 67 million units in the third quarter of 2017, a 3.6 percent decline from the third quarter of 2016, according to preliminary results by Gartner, Inc. This is the 12th consecutive quarter of declining PC shipments
PCB Material Prices May be Raised in October (2017.10.11)
TAIPEI, Taiwan - According to Taiwan's Economic Daily News, prices for upstream PCB materials will begin to be raised after the extended National Holiday in Mainland China. This is mainly due to tight international raw material prices and terminal demand
NVIDIA Announces World's First AI Computer (2017.10.10)
NVIDIA today unveiled the world's first artificial intelligence computer designed to drive fully autonomous robotaxis. The new system, codenamed Pegasus, extends the NVIDIA DRIVE PX AI computing platform to handle Level 5 driverless vehicles

  Top Ten News
1 PICMG COM-HPC 1.2 Mini Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
2 u-blox Introduces the Smallest Single-mode LTE Cat 1bis IoT Module
3 mechatronic systemtechnik GmbH Unveils Its New Technology Center in Fürnitz
4 u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
5 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
6 NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
7 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap

AD

Skyscraper="text/javascript">