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Mitsui Chemicals Tohcello Establishes a New Company in Taiwan (2017.10.23)
Mitsui Chemicals, Inc. announced that its wholly owned subsidiary, Mitsui Chemicals Tohcello, Inc. has decided to establish a company in Taiwan that will manufacture and sell the ICROS Tape, a tape for semiconductor manufacturing |
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Chroma Invested Touch Cloud Inc. to Embrace AI (2017.10.23)
TAOYUAN, Taiwan - Chroma ATE Inc., is aggressively taking part in AI by investing in Touch Cloud Inc. pioneered in AI solutions, as its largest corporate shareholder. Implementing AI into Chroma's core technologies will make their instrumentation and turnkey solutions smarter and a higher value to their customers |
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Expedition of MIT Indie Teams to Singapore GameStart (2017.10.23)
Taipei Game Show brought 4 Taiwan indie teams to GameStart 2017 in Singapore for the 3rd time. Through meeting with and listening to the feedback from developers and gamers in Southeast Asia, the teams explored the opportunity of overseas launching in the future |
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North American Semiconductor Equipment Industry Posts September 2017 Billings (2017.10.23)
North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in September 2017 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published by SEMI |
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Eco-Friendly Recycling Technology Allows for Common Sustainable Economy and Ecology (2017.10.20)
(圖一) UWin Nanotech manufactures E-Frog sculpture artworks which are used to remind people the importance of protecting natural ecology.
A tree frog is a special type of frog which ordinarily lives in lower levels of forests and on trees |
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Samsung Electronics Introduces Integrated Secure Element Solution for IoT Applications (2017.10.19)
Samsung Electronics introduced its integrated Secure Element (SE) solution for Internet of Things (IoT) applications that offers a turn-key service for both hardware and software needs.
As the benefits of IoT devices grow, so does the importance of security throughout the network that spans from cloud, servers and hubs to the individual connected devices |
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IC Insights Raises 2017 IC Market Forecast to +22% (2017.10.19)
IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its Mid-Year Update. The IC unit volume shipment growth rate forecast has also been increased from 11% depicted in the Mid-Year Update to 14% currently |
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TrendForce Reports Prices of Lithium-Ion Battery Cells Enters a Slow Climb (2017.10.19)
The latest lithium-ion battery market report from EnergyTrend, a division of TrendForce, finds that the price upswing for battery cells has started to moderate since this third quarter. Although the price of cobalt reached a new high for the recent years during the third quarter, prices of battery cells have been climbing more slowly after the large hikes in the second quarter |
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Axiomtek’s ICO120-83D - An Industrial IoT Gateway Enables Quickly Connect IoT Devices to the Cloud (2017.10.19)
Axiomtek has announced the upcoming availability of ICO120-83D, an industrial IoT gateway designed to simplify device-cloud connection and accelerate industrial internet of things development. It was specifically designed for smart energy and smart automation fields that need to collect and transfer data from large numbers of end devices |
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Gaming Monitor Shipments Soar 350% Year-over-Year, IHS Markit Says (2017.10.19)
Global shipments of gaming monitors increased 350 percent to 1.1 million units in the first half of 2017 from the same period a year ago, according to IHS Markit.
Gaming is the hottest application for desktop monitors, invigorating a mature product category |
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Samsung Introduces New ARTIK Secure IoT Modules and Security Services (2017.10.19)
Samsung Electronics today announced ARTIK secure “s” systems-on-modules and services for the ARTIK IoT Platform to strengthen edge security. Samsung ARTIK IoT platform now delivers device-to-cloud security for companies to build, develop and manage secure, interoperable, and intelligent IoT products and services for everything from smart homes to high-tech factories |
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M31 and Corigine Launch the World's First 28nm USB-IF Certified Superspeed+ USB 3.1 Gen 2 IP (2017.10.19)
M31 Technology Corporation, a global Silicon Intellectual Property (IP) boutique, today announced that Corigine’s USB 3.1 Gen 2 PC host and device controller intellectual property (IP) with M31 28nm PHY is certified by the USB Implementers Forum (USB-IF) and compliant with USB SuperSpeed+, the fastest USB speed standard |
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China Semiconductor Fab Equipment Spending Forecasted to Over Than $12 Billion (2017.10.18)
SEMI today announced its new China IC Industry Outlook Report. With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.
China is the largest consumer of semiconductors in the world, but it currently relies mainly on semiconductor imports to drive its growth |
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Intel and Mobileye Offer Formula to Prove Safety of Autonomous Vehicles (2017.10.18)
Mobileye and Intel today announced a formal, mathematical formula to ensure that a self-driving vehicle operates in a responsible manner and does not cause accidents.
Speaking today at the World Knowledge Forum in Seoul, South Korea, professor Amnon Shashua, Mobileye CEO and Intel senior vice president, offered the autonomous driving industry a way to prove the safety of autonomous vehicles |
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Power Integrations Opens New Production-Support and R&D Center in Malaysia (2017.10.18)
Power Integrations announced the opening of a new location in Penang, Malaysia. The facility will serve as a production-support and R&D center as well as an operations hub from which the company will manage its Asian supply chain |
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Samsung Completes Qualification of 8nm LPP Process (2017.10.18)
Samsung Electronics announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
The newest process node, 8LPP provides up to 10-percent lower power consumption with up to 10-percent area reduction from 10LPP through narrower metal pitch |
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Merger of Gintech, NSP and Solartech Will Contribute to Taiwan’s Solar Industry, Says TrendForce (2017.10.17)
Three solar companies Gintech, Neo Solar Power (NSP) and Solartech signed an MOU on October 16 announcing their intention to merge as one single corporate entity by the third quarter of 2018. According to EnergyTrend, a division of TrendForce, the combined production capacity for photovoltaic (PV) cells of these three companies is projected to reach 5 gigawatts (GW) |
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STMicroelectronics' Advanced Automotive Processors with Built-In Security Set (2017.10.17)
STMicroelectronics announced its latest automotive processors that feature a dedicated, built-in security module.
The new Telemaco3P telematics and connectivity processors (STA1385 and its variants) are the first automotive microprocessors to integrate a powerful, dedicated, isolated Hardware Security Module (HSM), which acts like an independent security guard to watch data exchanges and encrypt and authenticate messages |
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Worldwide Device Shipments to Increase 2.0% in 2018, Gartner Says (2017.10.17)
Worldwide shipments of PCs, tablets and smartphones are predicted to exceed 2.35 billion units in 2018, an increase of 2.0 percent from 2017, according to Gartner, Inc. This would be the highest year-over-year growth since 2015 |
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Molex Introduces Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connection System (2017.10.17)
Molex introduces the Pico-EZmate Slim 1.2mm Pitch Wire-to-Board Connector, designed to provide reliable connection in a compact profile that improves both reliability and assembly speed.
“As consumer electronics products get more compact, manufacturers are looking to reduce the overall device size while not sacrificing reliability or production flexibility,” said Rick Lee, global product manager, Molex |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.