 |
Seagate and Tencent Sign a Partnership MOU for Cooperation in the Field of Information Technology (2017.09.20)
Seagate Technology and Tencent Technology signed a Strategic Partnership Memorandum of Understanding (MOU) for cooperation in the field of information technology.
Tencent will regard Seagate as a key supplier of storage solutions, and Seagate will treat Tencent as a Strategic Partner and set up a special service team for Tencent |
|
Global SME Smart Phone OEMs to Experience Further Business Hardships (2017.09.20)
TAIPEI, Taiwan - According to the findings of a recent study conducted by IDC, during the second quarter of 2017, due to weakening market demand coupled with the postponement of new products, although the global smart phone industry's manufacturing output experienced a slight increase of 1 |
|
CPT and imec to Demonstrate 1250 ppi, FMM-free OLED Displays with Photolithography at Touch Taiwan (2017.09.20)
TAIPEI, Taiwan – Chunghwa Picture Tubes Ltd. (CPT) together with the European research institute imec in the framework of the Holst Centre collaboration, showcase today an ultra-high resolution display realized by photolithography patterning of organic light emitting diode (OLED) arrays |
|
DRAM Supply to Remain Tight With Its Annual Bit Growth for 2018 Forecast at Just 19.6% (2017.09.20)
DRAMeXchange, a division of TrendForce, forecasts that the global DRAM supply for 2018 will show an annual bit growth of just 19.6%, which is another low in recent years. The global top three major DRAM suppliers – Samsung, SK Hynix and Micron – are now in the midst of their capacity planning for 2018 |
|
GIS to Showcase Its Full-size Smart Touch Display Application at the Touch Taiwan (2017.09.20)
GIS announced today that the company will showcase its full-size smart touch display application at the Touch Taiwan, 2017 from September 20 to 22, including high screen to body ratio of curved, thin, narrower border and flexible smart phone, automotive and 3D curved lamination, large-size electronic whiteboard products, metal touch, and a number of advanced special application technology |
|
Intel Invests $1 Billion in the AI Ecosystem (2017.09.20)
Intel announced that it has invested in startups like Mighty AI, Data Robot and Lumiata through its Intel Capital portfolio and have invested more than $1 billion in companies that are helping to advance artificial intelligence |
 |
New Power Monitoring IC Increases Software Power Measurement Accuracy to 99% in Win10 Devices (2017.09.19)
The PAC1934, a precision power and energy monitoring chip, is now available from Microchip Technology Inc. The chip works in conjunction with a Microchip software driver that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system to provide 99 percent accuracy on all Windows 10 devices that have batteries |
|
AUO Presents World’s Largest 8K4K Bezel-less TV Display (2017.09.19)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced today that it will participate in Touch Taiwan 2017 at Taipei Nangang Exhibition Center from September 20 to 22 to showcase a full lineup of advanced large-sized display technologies and products |
|
Samsung Introduces Advanced, Enhanced Chip-Scale LED Packages for Spotlights and High-Bay (2017.09.19)
Samsung Electronics announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-leading efficacy and reliability for spotlights and high-bay lighting applications |
|
Intel Showcases Industry’s First 64-Layer 3D NAND for Data Center, Updates for 10nm in China (2017.09.19)
Intel delivered key updates at its Technology and Manufacturing Day held in Beijing, China, on Sept. 19. Disclosures included power and performance updates for Intel’s 10 nm process, high-level plans for Intel’s first 10 nm FPGA, and an announcement that the company is shipping the industry’s first commercially available 64-layer 3D NAND for data center applications |
|
ITRI’s New Liquid Nanoparticle Monitoring System Can Inspect Particles Down to 5nm (2017.09.19)
TAIPEI, Taiwan - Taiwan's Industrial Technology Research Institute (ITRI) participated in the SEMICON Taiwan exhibition to showcase a “Liquid Nanoparticle Monitoring System” with the capacity of inspecting 5nm grade solutions in an independent exhibition booth for the first time |
|
TI's Stackable 16-V Input, 40-A SWIFT DC/DC Buck Converter Features Innovative Control Topology (2017.09.19)
Texas Instruments (TI) introduced the industry's first 16-V input, 40-A synchronous DC/DC buck converter with an internally compensated advanced-current-mode (ACM) control topology supporting frequency synchronization.
TI's TPS543C20 SWIFT converter provides enhanced efficiency by integrating its latest generation of low resistance high- and low-side MOSFETs into a thermally efficient small-footprint package |
|
Seagate and Baidu Sign Strategic Cooperation Agreement for Big Data Analysis (2017.09.18)
Seagate Technology plc today announced the signing of a strategic cooperation agreement with Baidu covering the fields of information technology, big data analysis and advanced storage system development and implementation.
The pact renews an existing agreement between the two firms signed in September 2014 |
|
Vishay Intertechnology Launches Industry-First High Frequency IHLP Inductor Series (2017.09.18)
Vishay Intertechnology introduced the first extended-frequency inductor in the low profile, high current IHLP family. The new IHLP 1616BZ-0H series features high frequency performance up to 10 MHz with the lowest losses of any inductor on the market for frequencies of 1 MHz and above |
|
Dual Input Prioritizer Provides Low Quiescent Current Backup Supply Switchover Solution (2017.09.18)
Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC4418, a dual input power prioritizer for 2.5V to 40V systems. To enable portability, preserve memory during brownouts, and ensure a graceful shutdown on power loss, electronic systems employ batteries and capacitors for backup power |
|
Telink Semiconductor to Demonstrate Its Smart Solutions at Bluetooth Asia 2017 in Shenzhen (2017.09.18)
Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017 |
|
AUO to Demonstrate Its LTPS Displays and AMOLED Technology at Touch Taiwan 2017 (2017.09.18)
AU Optronics Corp. (AUO) today announced its participation to Touch Taiwan 2017 from September 20 to 22. This year the exhibition highlights include AUO’s full range of LTPS displays, demonstrating the Company’s accomplishments in the field |
|
Toshiba to Unveil Low Voltage 5GHz Receiver for Next-Generation Wireless LAN (2017.09.18)
Toshiba Electronic Devices & Storage Corporation (TDSC) announced development of a low voltage 5GHz receiver for the next-generation IEEE802.11ax1 wireless LAN. The company reported details of the technology on September 14th at the European Solid-State Circuits Conference in Belgium |
|
Finance Is Moving to the Cloud Much Faster Than Expected, Gartner Says (2017.09.18)
According to Gartner, Inc. A recent Gartner survey of senior finance executives found that by 2020, 36 percent of enterprises will use the cloud to support more than half of their transactional systems of record.
Gartner sur |
|
E Ink, Ueberall and the San Diego Airport to Introduce the World’s Largest e-Paper Media (2017.09.15)
E Ink Holdings, Ueberall International, and the San Diego International Airport, unveiled DAZZLE, a monumental public artwork featuring the largest deployment of E Ink’s Prism technology.
Located at the San Diego International Airport’s new Rental Car Center |
