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德州仪器致力缔造美好社会 拥抱多元包容价值拉近距离 (2023.01.10)
德州仪器 在台深耕 50 多年，持续透过半导体让电子产品变得更加实惠，进而创造一个更美好的世界。除了积极发展创新解决方案外，TI 更期许成为与当地社区共好的友邻企业 |
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能源产业成就物联网未来？ (2017.02.02)
由于大量的智慧型电子装置部署于变电所及配电网路，因此各界经常将能源产业视为实现IoT理所当然的机会与目标。 |
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[OSHW 2013]开放硬件运动精神：在创意，不在杀价竞争 (2013.08.13)
开放硬件运动的发展在全球科技产业中其实已有好一段时间，但对台湾来说，所谓的「开放硬件」四字，却仍然有着一定程度的陌生感。
如果真的要说，开放硬件运动应该可以说是开放原始码后所迎来的新一波科技浪潮 |
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-Application Response Measurement (ARM) 0.8beta1 (2008.07.31)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-.netTiers 2.2.0 (2008.05.22)
.netTiers is a set of open source code generation templates that simplify the tasks of creating customized application tiers for your Microsoft .NET applications in just a few minutes. .netTiers utilizes the power of the best |
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-Application Response Measurement (ARM) 0.7beta1 (2008.05.12)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Medea: pragmatic and simple MDA 1.0.alpha (2008.01.13)
Medea is a pragmatic code generation framework. It takes UML class and state diagrams in XMI format and uses XSLT templates to generate code for various technologies, tiers and complete applications: J2EE, CMP, Hibernate, JSP |
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-Application Response Measurement (ARM) 0.6 (2007.12.01)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Application Response Measurement (ARM) 0.4 (2006.12.09)
An implementation of the Open Group's Application Response Measurement (ARM) Version 4 standard. The ARM standard describes a means of breaking an application down into it's constituent transactions, and measuring response time across multiple tiers |
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-Cappuccino CyberCafe Cappuccino Serveur & Client (2006.11.08)
Cappuccino est un programme de gestion Cybercafe qui utilise une architecture 3-tiers, avec une DB Mysql. -Gestion des comptes prepayes. -Definition simple de la tarification. -Utilisation de la VOIP avec les postes clients. |
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-openhsm 1.1.3 (2006.05.17)
OpenHSM is policy based software for managing files. Files can be automatically backed up to tape or to a mirror filesystem. Data can be removed from files and transparently retrieved if the file is accessed. All tiers are peers, and may run policy |
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地理资讯系统面面观 (2006.05.10)
地理资讯系统于1980年代引进台湾，透过学界逐渐在政府部门萌芽，作业平台也从高阶工作站朝向个人作业系统环境；系统也从单机迈向主从架构，随着网际网路的兴起，n-tiers网路浏览器架构也随之应运而生，其发展与空间图资搜集和制作、资讯与网路通讯技术、及应用领域的空间分析等有密不可分的关系 |
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-.NetTiers: OR mapper codesmith template 0.9.2 - Caribert (2005.11.23)
.NetTiers are CodeSmith templates for object-relational mapping that takes an existing SQLServer database and automatically generates a personnalized Data Tiers application block to use in your .Net applications. |
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-.NetTiers: OR mapper codesmith template v1 beta 1 - Clotaire (2005.07.26)
.NetTiers are CodeSmith templates for object-relational mapping that takes an existing SQLServer database and automatically generates a personnalized Data Tiers application block to use in your .Net applications. |
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Hitachi Data Systems荣获IDC最佳「领导潮流」解决方案 (2005.06.14)
企业储存解决方案厂商Hitachi Data Systems（HDS；Hitachi子公司）宣布，其Hitachi TagmaStore通用储存平台(Hitachi TagmaStore Universal Storage Platform)荣获全球知名研究调查顾问公司IDC最新「网络储存控制器」(NSC；Networked Storage Controller)评鉴类别中的最佳「领导潮流」解决方案 |
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多维空间晶粒堆栈世代正式来临！ (2005.05.05)
卢超群认为，晶粒堆栈技术将是半导体产业界未来数十年的大革新，这种趋势总称为异质性整合，让晶粒由原本的二度空间排列转而成为三度空间堆栈。而钰创这一小步也宣示了多维空间晶粒堆栈的大时代将正式来临 |
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-openhsm 1.0.22 (2005.03.03)
OpenHSM is policy based software for managing files. Files can be automatically backed up to tape or to a mirror filesystem. Data can be removed from files and transparently retrieved if the file is accessed. All tiers are peers, and may run policy |
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细间距封装技术发展与应用探讨 (2002.10.05)
虽然覆晶技术能在电性和散热能力能达到极佳的效能，然而在高成本与其他相关量产条件的考虑下，目前对于500至700脚数的产品而言，细间距技术仍然是优先的选择。现阶段后段的封测厂商仍然应该把握细间距封装技术快速成长的发展潜力与可降低总体成本的优势，在不影响电性表现的前提下，寻求突破现阶段技术瓶颈的解决方案 |
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日月光发表三层铝垫封装技术 (2002.07.26)
日月光半导体（ASE）日前表示三层铝垫封装技术(Tri-tiers Wire Bonding)已开发完成，针对高I/O设计的IC充分提供了高密度、小尺寸高与低成本的产品需求服务，促使IC效能获得更进一步的提升 |
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十家厂商联合发起「校园软件先锋项目」 (2002.03.28)
国内外软件厂商包括倍力信息、Sybase、以柔信息、Leccotech、Software AG、Intershop、德胜网际、智酷科技、全华科技图书等超过十家厂商，为缩短学校软件教育与业界实际应用的落差，今日对外宣布联合发起了「校园软件先锋项目」，会中除了展示企业级软件开发与技术应用趋势外，更提出校园各项专属优惠解决方案 |
