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Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021 (2021.04.11)
Total semiconductor unit shipments, which include integrated circuits as well as optoelectronics, sensor/actuator, and discrete (O-S-D) devices, are forecast to rise 13% in 2021, to 1,135.3 billion (1.1353 trillion) units to set a new all-time annual record, based on data presented in the 2021 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry |
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Global IC Market Forecast Lowered From 3% to -4%, Says IC Insights (2020.04.12)
When 2020 started, global economic conditions pointed to single-digit percentage sales growth in the IC market after it fell by 15% in 2019, according to IC Insights. However, the world abruptly changed in 1Q20 with the rapid outbreak of the Covid-19 virus, which shut down nearly all countries and paralyzed global markets beginning in March 2020 |
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Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules (2020.03.25)
SamsungElectronics today announced that it has successfully shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications |
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Propelled by 51% Share of IDM Sales and 65% Share of Fabless Sales, U.S. Companies Captured 55% (2020.03.22)
Regional marketshares of IDMs (companies operating wafer fabs), fabless companies, and total IC sales were led by U.S. headquartered companies in 2019, according to data presented in the recently released March Update to The McClean Report 2020 |
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TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology (2020.03.17)
TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN) |
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Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner (2020.02.27)
This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process |
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Samsung Electronics Begins Mass Production at New EUV Manufacturing Line (2020.02.20)
Samsung Electronics today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.
The facility, V1, is Samsung’s first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below |
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SiP and Heterogeneous Integration as Key Driving Force of Growth for IC Packaging and Testing (2020.02.03)
TAIPEI, Taiwan - Amid continued economic uncertainty and high inventory levels, growth of the worldwide IC packaging and testing industry is expected to slow down, and the worldwide IC packaging and testing industry shipment value is estimated to reached US$29 |
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Semiconductor R&D To Nudge Higher Through 2024 (2020.02.03)
The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies |
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eMemory and UMC Qualify NeoFuse IP on the Foundry’s 28nm High Voltage Process (2020.01.20)
HSINCHU, Taiwan – eMemory and United Microelectronics Corporation today announced that eMemory’s NeoFuse IP has been qualified on UMC’s 28nm High Voltage (HV) platform to target the fast-growing OLED market.
Key customers have completed successful product tape outs using this IP and process, which are ready for mass production |
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Worldwide Semiconductor Revenue Declined 11.9% in 2019, Gartner Says (2020.01.17)
Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018, according to preliminary results by Gartner, Inc. Intel regained the No. 1 position in the market as the downturn in the memory market negatively impacted many of the top vendors, including Samsung Electronics, the No |
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TSMC Reports Fourth Quarter EPS of NT$4.47; Projects a Strong Outlook of 2020 (2020.01.16)
HSINCHU, Taiwan – TSMC today announced consolidated revenue of NT$317.24 billion, net income of NT$116.04 billion, and diluted earnings per share of NT$4.47 (US$0.73 per ADR unit) for the fourth quarter ended December 31, 2019 |
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Global OSAT Market Shows Signs of Recovery in 2H19, But Yearly Revenue to Decline Slightly (2019.11.20)
According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales steadily recovered. The top ten OSAT providers posted a total revenue of US$6 billion in 3Q19, a 10 |
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Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (2019.11.18)
HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design |
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TSIA Q3 2019 Statistics on Taiwan IC Industry (2019.11.18)
The TSIA survey showed that Q3 2019 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$721.7 billion(US$23.9B) (15.4% growth on-quarter and up 4.4% on-year).
With NT$186.0B in design(US$6 |
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Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019 (2019.11.06)
The share of semiconductor industry capital spending held by the top five companies’ (i.e., Samsung, Intel, TSMC, SK Hynix, and Micron) is forecast to reach an all-time high of 68% this year, surpassing the previous record high of 67% recorded in 2013 and 2018 |
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China GDP and PMI Contraction: A Risk Factor For Global Economy (2019.10.30)
IC Insights recently released its October Update to The McClean Report 2019. Part of the update reviewed U.S. and China GDP and PMI trends in light of the current trade friction between the two nations.
Given that the global economy increased by a healthy 3 |
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DELO Introduces Compact LED Curing Lamp DELOLUX 503 (2019.10.23)
DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars |
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Wafer Capacity by Feature Size Shows Rapid Growth at <10nm (2019.10.17)
Leading-edge processes ( |
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M31 Memory Compiler and GPIO are certified with ASIL-D safety level of ISO 26262 (2019.10.17)
HSINCHU, Taiwan – M31 Technology today announced that: Following the high-speed interface IP MIPI M-PHY, Memory Compilers and GPIO IP have also been certified by the German institution SGS-TÜV for ISO 26262 automotive safety highest level ASIL-D Ready certification, to provide safe and reliable automotive electronic design solutions |
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