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赛灵思ISE12设计套件采用全新智能型频率闸控技术 (2010.05.07) 赛灵思(Xilinx)日前宣布推出全新ISE 12设计套件软件,为顾客提供前所未有的功耗与成本优化,以及更高的设计生产力。ISE设计工具提供业界智能型频率闸控技术,可降低高达30%的动态功耗 |
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德州仪器 C6x DSP采用 Linux 架构 (2010.05.05) 德州仪器(TI)日前宣布?其C6x系列数字信号处理器(DSP)与多核心系统单芯片(SoC)提供 Linux 核心支持,以充分满足通讯与关键任务基础设施、医疗诊断以及高效能测量测试等应用需求 |
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三星电子发表全新显示驱动芯片封装解决方案 (2010.05.05) 三星电子(Samsung)今日宣布其专为高阶电视应用的显示驱动芯片(DDI)而新开发的散热封装技术解决方案,三星的全新超低温薄膜覆晶(ultra Low Temperature Chip On Film; u-LTCOF)封装解决方案,透过最小化DDI封装与显示面板底座之间的接触热电阻,进而提升高效能与高分辨率电视的散热 |
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从3D IC/TSV 的不同名词看3D IC 技术 (下) (2010.05.05) 目前,3D-IC定义并不相同,有人认为只要将一颗 die 放在一个substrate 上就是 3D integration,这似乎与将Chip 放在PCB上面没有两样,顶多称之为3D Package。 3D-IC与3D 封装(package)不同的是,3D Package 里面的元件是离散的,都是在元件的周边利用bonding wire 相接,但是3D IC 却是一个独立的IC,透过垂直与水平整合来大量提高集积密度 |
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电子高峰会:从里到外 FPGA设计弹性有坚持 (2010.05.04) 随着多媒体影音数据传输需求的不断提升,带宽需求量也越来越高,带宽背后的处理效能也越来越受到重视。从内部核心架构到外部市场策略,少量多样的FPGA设计也面临转折点,客制化的弹性中仍见一般的坚持 |
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Freescale推出新款可程序数字讯号 (2010.04.30) 飞思卡尔(Freescale)日前推出一系列的可程序化数字信号处理器(DSPs),具备最佳的低成本与高效益比,适合医疗、航天/国防及测试/测量市场的多项应用。MSC825x系列的可延展DSP使用业界效能顶尖的飞
思卡尔SC3850 StarCore DSP核心,它具备更佳的效益与功能,但与其他替代技术相较之下,仅需一半的成本 |
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CEVA DSP核心获Sequans的4G芯片组采用 (2010.04.27) CEVA DSP日前宣布,公司已授权4G芯片组的制造商Sequans Communications公司使用CEVA-X1641 DSP核心,将应用在Sequans的下一代LTE和WiMAX基频处理器中。CEVA-X1641核心将为Sequans下一代基频芯片提供更大的灵活性 |
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从3D IC/TSV的不同名词看3D IC技术(上) (2010.04.19) 目前,3D-IC定义并不相同,有人认为只要将一颗 die 放在一个substrate 上就是 3D integration,这似乎与将Chip 放在PCB上面没有两样,这样的PCB也可以称之为3D integration,所以顶多称之为3D Package |
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TI推出高整合度的低成本RF增距器 (2010.03.09) 德州仪器(TI)宣布针对850至950 MHz的低功耗无线应用,推出高整合度的低成本射频(RF)增距器,可满足无线感测网络、自动抄表(AMR)以及无线工业控制、消费性及音频系统等应用需求 |
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英飞凌推出OptiMOS稳压MOSFET及DrMOS系列产品 (2010.03.08) 英飞凌科技近日于美国加州举办的「2010 应用电力电子研讨会暨展览会」上,宣布推出新款OptiMOS功率MOSFET系列产品。英飞凌所推出的OptiMOS 25V系列装置经过优化,适合应用于计算机服务器电源之稳压及电信/数据通讯之开关 |
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英特尔副总裁Thomas Macdonald加入奇尔董事会 (2010.03.03) CHiL美商奇尔半导体宣布, Thomas R. Macdonald已加入其董事会。Macdonald先生自1988年加入英特尔以来,先后担任过多个部门总经理以及高阶策略微处理器和平台营销管理等职位 |
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Blackfin Development Tools Bundle (2010.03.03) Blackfin Development Tools Bundle |
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GSA将在台湾举办Memory Conference (2010.03.02) 全球半导体联盟(GSA)正式宣布,GSA Memory Conference将于2010年3月16日星期二于台北晶华酒店盛大举行。本活动为业界首次以结合Memory及Logic IC达到更佳系统效能为活动主轴的研讨会 |
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Blackfin Development Tools Bundle (2010.03.01) For a limited time, you can begin your Blackfin processor design at a discounted rate, over 70% off the regular price. This offer is available from March 1st to May 28th , so order your bundle today to get started. |
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BLACKFIN USB-LAN EZ-EXTENDER (2010.03.01) The Blackfin® USB-LAN EZ-Extender daughter board allows developers to connect to the Asynchronous Memory Bus on the ADSP-BF533 EZ-KIT Lite, ADSP-BF537 EZ-KIT Lite and ADSP-BF561 EZ-KIT Lite.
The EZ-Extender has peripherals that support USB 2 |
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BLACKFIN EZ-EXTENDER (2010.03.01) The Blackfin EZ-Extender daughter board allows developers to connect the Parallel Peripheral Interface (PPI) on the ADSP-BF533 EZ-KIT Lite and the ADSP-BF561 EZ-KIT Lite to a number of Analog Devices High Speed Converter (HSC) evaluation boards (ADC, mix signal, and DAC), the OV6630 OmniVision camera evaluation board, and an external LCD display |
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LABVIEW EMBEDDED MODULE FOR ANALOG DEVICES BLACKFIN PROCESSORS (2010.03.01) The National Instruments LabVIEW™ Embedded Module for Analog Devices Blackfin® Processors is a comprehensive graphical development environment for embedded design. Jointly developed by ADI and NI, this module seamlessly integrates the LabVIEW Development Environment and Blackfin Embedded Processors |
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LABVIEW EMBEDDED MODULE FOR ANALOG DEVICES BLACKFIN PROCESSORS (2010.03.01) The National Instruments LabVIEW™ Embedded Module for Analog Devices Blackfin® Processors is a comprehensive graphical development environment for embedded design. Jointly developed by ADI and NI, this module seamlessly integrates the LabVIEW Development Environment and Blackfin Embedded Processors |
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EZ-KIT LITE EVALUATION KIT FOR ADSP-BF561 BLACKFIN PROCESSOR (2010.03.01) The ADSP-BF561 EZ-KIT Lite® provides developers with a cost-effective method for initial evaluation of the ADSP-BF561 Blackfin® Processor for audio and video applications via a USB-based PC-hosted tool set. Evaluation of analog audio applications is achieved through the use of the AD1836 multichannel 96 kHz audio codec |
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EZ-KIT LITE FOR ANALOG DEVICES ADSP-BF537 BLACKFIN PROCESSOR (2010.03.01) The ADSP-BF537 EZ-KIT Lite® provides developers with a cost-effective method for evaluation of the ADSP-BF537 Blackfin® Processor and its rich set of system peripherals, including the IEEE 802.3 10/100 Ethernet MAC and CAN 2 |