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NOR Flash May Be in Short Supply Next Year, Macronix Says (2016.11.01)
TAIPEI, Taiwan - Taiwanese memory manufacturer Macronix last week stated that the phenomenon of a NOR Flash Memory shortage may materialize next year.
Macronix is one of Taiwan’s main NOR Flash Memory suppliers and currently occupies the second biggest proportion of the global market at 23% |
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Vishay’s Ultra-Precision Thin Film Chip Resistor with Low TCR of ± 2 ppm/°C (2016.11.01)
Vishay Intertechnology introduced a new ultra-precision thin film chip resistor that offers a dramatic improvement in TCR and tolerance over previous-generation devices. Available in five case sizes from 0603 to 2512, the Vishay Dale Thin Film PLTU offers a tight TCR of ± 2 ppm/°C and tolerance of ± 0 |
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TI Unveils the Industry's First Single-chip 60-V eFuse with Reverse Polarity Protection (2016.11.01)
Texas Instruments (TI) introduced the first single-chip eFuse with back-to-back FETs, providing the industry's highest rating of protection at up to 60 V.
Offering on-chip advanced features including reverse polarity protection and reverse current blocking, the TPS2660 is the most integrated eFuse on the power management market for 24-V and 48-V rail applications in industrial, automotive and communication infrastructure designs |
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Toshiba New Stepping Motor Driver IC Lowers Motor Noise and Vibration (2016.10.31)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TB67S209FTG”, a stepping motor driver with an architecture that lowers noise and vibration during motor operation. Mass production is slated to begin at the end of December |
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Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates (2016.10.31)
At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.
Reporting two industry-first achievements that are crucial for ultralow-power beyond-CMOS technology |
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12A Ultrathin µModule Regulator Configurable as Quad, Triple, Dual or Single Output (2016.10.28)
Linear Technology Corporation introduces the LTM4643 quad output step-down µModule (power module) regulator, configurable as a single output (12A), dual (6A & 6A or 9A & 3A), or quad (3A each) regulator in a 9mm x 15mm x 1.82mm ultrathin LGA package |
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Industry’s First Automotive-Grade LIN System-in-Package Solution (2016.10.27)
The industry’s first automotive-grade Local Interconnect Network (LIN) System-in-Package (SiP) solution including a microcontroller with integrated touch hardware support is now available from Microchip Technology.
The SAMHA1GxxA microcontroller family contains capacitive touch hardware support, an event system and complex PWM capability |
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UMC Reports Q3 Revenue of 3.2% Growth and Looks Forward Its 12" Fab in Xiamen, China (2016.10.26)
TAIPEI, Taiwan - United Microelectronics Corporation (UMC) today announced its consolidated operating results for the third quarter of 2016. Third quarter consolidated revenue was NT$38.16 billion, up 3.2% quarterly from NT$37 billion in 2Q16 and an increase of 8 |
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Morris Chang: Intel will Discover Foundry is a Difficult Business (2016.10.25)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) Chairman Morris Chang last week replied to a question from Taiwanese media stating that Intel is not a specialized IC foundry and is only testing the waters |
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New RC-E Discrete IGBTs from Infineon Allow for Drop-in Replacement (2016.10.24)
Infineon Technologies AG launches a new family of discrete IGBTs. The new RC-E devices are cost optimized and specifically meet the demands of low- to mid-price range induction cookers and induction rice cookers.
The new RC-E family features an IGBT with monolithically integrated reverse conduction diode for resonant switching |
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STM Introduces STM32H7 Series of MCUs, Embeds 1Mbytes SRAM and 2MB Flash (2016.10.21)
STMicroelectronics (STM) introduced its new record-breaking STM32H7 series of microcontrollers, which embeds the highest SRAM memory (1Mbytes), Flash memory up to 2MB, and the richest connectivity peripheral set ever seen in the STM32 platform |
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New Material Approach for MEMS and 3D IC (2016.10.20)
PiBond today announced that its SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market |
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Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package (2016.10.20)
Samsung Electronics announced that it is introducing the industry’s first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices |
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Rebound in DRAM Market Helps Raise Outlook for Total IC Market, IC Insights Says (2016.10.20)
IC Insights has raised its IC market forecast for 2016 by three percentage points from a 2% decline to a 1% increase and its 2016 IC unit volume shipment growth rate forecast from 4% to 6%. A large portion of this revision is due to a strengthening DRAM market |
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Knowles, Goertek and AAC Rank the Top 3 Suppliers of MEMS Microphones (2016.10.19)
Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015, according to IHS Markit.
MEMS (micro-electromechanical systems) technology is utilized to produce microphones used in laptops, hearing aids, wearables and smartphones among many other products |
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TSMC Projects Three Subjects Will Grow in the Next Five Years (2016.10.18)
TAIPEI, Taiwan – As the biggest IC foundry in the world, TSMC has most leading tech companies in its hand, and that is why TSMC’s project of the market trend is so important to technology industry.
Recently, TSMC had pointed out that smartphones |
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New EERAM Memory Offers Unlimited Endurance Along with Safe Data Storage at Power Loss (2016.10.18)
A new low-cost, low-risk memory solution offering unlimited endurance and safe data storage at power loss is now available from Microchip Technology. This new I2C EERAM memory is an easy-to-implement, non-volatile SRAM memory that is ideal for applications that need to constantly or instantaneously record, update or monitor data including metering, automotive and industrial applications |
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Samsung Starts Mass Production of SoC with 10nm FinFET Technology (2016.10.17)
Samsung Electronics today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
Following the successful mass production of the industry’s first FinFET mobile application processor (AP) in January, 2015, Samsung extends its leadership in delivering leading-edge process technology to the mass market with the latest offering |
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SMIC Starts Construction of a New 12-Inch Wafer Fab in Shanghai, China (2016.10.14)
Semiconductor Manufacturing International Corporation (SMIC), one of semiconductor foundries in Mainland China, yesterday held its groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs |
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Toshiba's New Transistor Arrays Have Data Storage Function (2016.10.14)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TBD62089APG”, a new-generation transistor array for applications such as LED lighting for amusement equipment and high voltage signal transmitters for industrial equipment |
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