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Powertron Announces Industry's First Ultra-High-Precision Current Sense Resistors (2016.10.14)
VPG Foil Resistors, a Vishay Precision Group, Inc. product group, announced today that its Powertron brand has expanded its S-Line of precision Bulk Metal® Foil current sense resistors with the new SHLR series. For industrial and energy applications, the SHLR 4-2321, SHLR 4-3825, and SHLR 4-3825H are the industry's first such devices to combine low resistance down to 0 |
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TSMC Is Confident Its 7nm to Be Ahead of the Competitions (2016.10.13)
TAIPEI, Taiwan – After reaching a historical high of Q3 revenue, TSMC today projected its Q4 revenue of 2016 will be about NT$255 billion to NT$258 billion, slightly decline 0.9% to 2%. In addition, TSMC indicated that it was optimistic about its developing progress of 7nm technology and the company will take the lead in the advanced process competition |
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64 Ports of 100GE with Tomahawk II 6.4Tbps Ethernet Switch from Broadcom (2016.10.13)
Broadcom Limited announced immediate availability of its new family of switches optimized for cloud-scale data centers deploying high density 100G switching solutions. Building on the widely deployed StrataXGS Tomahawk and Trident switch products |
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Samsung's 7nm Process May Be Behind the Schedule (2016.10.12)
TAIPEI, Taiwan - According to news from Taiwan's Economic Daily News, progress on Samsung's 7nm production is behind schedule and mass production will be impossible for them next year. However, Taiwan Semiconductor Manufacturing Company (TSMC) will carry out risk trials for 7nm products in Q1 of next year and expect to do commercial production during Q4 of next year so that it will contribute to their revenue in 2018 |
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Inotera Announces the Share Swap Record Date with Micron Semiconductor Taiwan (2016.10.12)
TAOUYAN, Taiwan - Inotera's Board of Directors today approved the extension of the Outside Date of the Share Swap Agreement from November 30th, 2016 to December 31st, 2016 and determined the share swap record date to be December 6th, 2016 to conduct a share swap transaction with Micron Semiconductor Taiwan Co |
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20V, 500mA LDO with Ultralow (0.8μVRMS) Noise & 76dB PSRR (2016.10.12)
Linear Technology Corporation announces the LT3045, an ultralow noise, ultrahigh power supply ripple rejection (PSRR) low dropout voltage linear regulator, a higher output current version of the widely accepted 200mA LT3042 ultralow noise LDO |
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NAND Flash Prices on Upswing in Q4,TrendForce Says (2016.10.11)
The supply shortage that persisted in the NAND Flash market during the third quarter will become more acute in the fourth quarter due to surging demand from clients in the smartphone and SSD industries, says DRAMeXchange, a division of TrendForce |
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Samsung Mass Produces 14nm FinFET Application Processor for Wearable Devices (2016.10.11)
Samsung Electronics today announced that it has begun mass production of the Exynos 7 Dual 7270. It is the first mobile application processor (AP) in the industry designed specifically for wearable devices with 14-nanometer (nm) FinFET process technology |
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Samsung 960 PRO and 960 EVO, the V-NAND Based SSDs (2016.10.10)
Samsung Electronics unveiled the Samsung 960 PRO and 960 EVO, its newest solid state drives (SSDs). The V-NAND based, M.2 form factor SSDs were built on the company’s category-defining Non-Volatile Memory Express (NVMe) SSD leadership |
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World's First Transceiver Chip with FCC's New V-band Frequencies (2016.10.07)
Sivers IMA launches a fully integrated V-band transceiver RFIC. The difference between this transceiver and previous generations from Sivers IMA is that all parts are made of Silicon-Germanium. The circuit includes a complete millimeter wave transceiver (transmitter and receiver), digital control, signal source and a complete analog baseband |
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Wafer Size to Dominated by 300mm and to Continue Increasing Through 2020 (2016.10.07)
According to IC Insights’ Global Wafer Capacity 2016-2020 report that worldwide capacity by wafer size was dominated by 300mm wafers in 2015 and is forecast to continue increasing through 2020, the ambitious goals to put 450mm wafers to use have been scaled back due to enormous financial and technology hurdles |
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Alliance Memory's New 512-Mb High-Speed Mobile SDR SDRAM (2016.10.06)
Alliance Memory introduced two new high-speed CMOS mobile synchronous DRAMs (MSDR) designed to extend battery life in mobile devices. Featuring low power consumption of 1.8 V and a number of power-saving features, the 512-Mb AS4C32M16MS and AS4C16M32MS are offered in 8-mm by 9-mm 54-ball and 8-mm by 13-mm 90-ball FPBGA packages |
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World's First Demodulator IC Compatible with Both ISDB-S3 and ITU-T J.183 (2016.10.06)
Socionext has developed the world's first demodulator IC that is compatible both with the Advanced Wide-Band Digital Satellite Broadcasting (ISDB-S3) and ITU-T Recommendation J.183 based channel bonding technology.
The new SC1501A can receive both the direct signals from the satellites and the retransmission of satellite signals through cable systems (IF pass-through, transmodulation) for 4K and 8K broadcasting |
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Dual Input, 2.5A Synchronous Step-Down DC/DC Converter Delivers 95% Efficiency (2016.10.06)
Linear Technology Corporation announces the LTC3126, a 2.5A, 42V synchronous step-down switching regulator with an integrated dual input PowerPath control. A unique power stage topology enables operation from either of two independent power sources, with seamless, internally controlled transitions between inputs to ensure a stable output voltage during hot-plug and power source disconnect events |
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The World’s Most Energy-Efficient Biomedical Sensor Hub for Wearable Health Applications (2016.10.05)
imec, and Holst Centre (established by imec and TNO), yesterday announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications. The SoC combines an unprecedented number of biomedical analog interfaces into a single chip, on-board digital signal processing, high fidelity operation, and multi-day monitoring capability with a single battery |
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Rugged 1.8kVA AC Inverter with Integral Li-ion Battery Charger (2016.10.05)
Phihong has released a compact, portable 1.8kVA inverter with an integral battery charger designed with four standard lithium-ion (Li-ion) battery packs. Designed to provide original equipment manufacturers with reliable, energy-efficient, and cost-effective power solutions, the new inverter is engineered to deliver 120Vac at 16A/1 |
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New Digitally Enhanced Power Analog Controllers (2016.10.04)
A new Digitally Enhanced Power Analog (DEPA) controller designed to regulate current, regulate voltage and monitor temperature is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions |
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Industry's First Fully Integrated DDR Memory Power Solution (2016.10.04)
Texas Instruments (TI) introduced the industry's first fully integrated power management solution for double date rate (DDR)2, DDR3 and DDR3L memory subsystems in automotive and industrial applications.
The TPS54116-Q1 DC/DC buck converter is a 2 |
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Average Contract Price for DRAM to Hit Two-Year High in Q4, Says TrendForce (2016.10.03)
The global average contract price of PC DRAM rose 7.4% monthly in September to US$14.5 as DRAM makers adjusted their product mixes and caused PC DRAM supply to tighten significantly, says DRAMeXchange, a division of TrendForce |
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Taiwanese Fabless IC Design Industry to Continue Growth in 2017 (2016.10.03)
TAIPEI, Taiwan - Shipment value of the Taiwanese fabless IC industry is estimated at NT$574.6 billion in 2016, up 11.3% year-on-year, according to MIC (Market Intelligence & Consulting Institute), a Taipei-based IT research institute |
One wants to meet different market needs of general-purpose interface Bus standards, can continue to upgrade transmission speeds and greater bandwidth, to achieve speed, capacity, quality and other multivariate integration, enhance the effectiveness of desire?