 |
VSON4 Small Package Photorelays with 110 Degrees Celsius Maximum Operating Temperature (2016.10.03)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company announced the launch of a new line-up of its small package “VSON4 Series” photorelays that extends the upper end of the operating range from 85 to 110 degrees Celsius |
 |
TSMC Invests Around 400 R&D Manpower in 3-nm Developing (2016.09.30)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) said yesterday that the company will actively develop 5 nanometers process technology, while putting about 300 to 400 R&D personnel in developing more advanced 3-nanometer process, and toward the 1-nanometer manufacturing process |
|
Industry’s Smallest-Package and Lowest-Power MEMS Oscillators (2016.09.30)
Microchip Technology announced the availability of the DSC6000 family of Micro-Electro-Mechanical Systems (MEMS) oscillators. The new family is the industry’s smallest MEMS MHz oscillator with the lowest power consumption over full frequency range of 2 KHz to 100 MHz |
|
Low-Power MCUs for Compact Sensor Hub Applications (2016.09.30)
Renesas Electronics America announced the RL78/G11 Group of microcontrollers (MCUs), a group of small-package, low-power MCUs that will enable users to easily and more quickly prototype and develop systems that support low-power sensor hubs and sensor application systems |
|
Samsung Electronics and SAP Open Research Center for Next-generation In-memory Platform (2016.09.29)
Samsung Electronics and SAP SE, today held the opening ceremony for a joint research center where engineers will conduct R&D for memory solutions to be used in next-generation in-memory computing.
The establishment of the research center is part of an extended partnership between the two world-leading corporations |
|
Mesh Networking Module Simplifies Thread and ZigBee Connectivity (2016.09.29)
Silicon Labs has introduced a new family of Wireless Gecko modules focused on mesh networking applications with support for best-in-class ZigBee and Thread software.
Silicon Labs’ new MGM111 module is the first in this comprehensive family of multiprotocol modules based on the Mighty Gecko system-on-chip (SoC) device |
|
Remote Control Window Sizing Tool for IR Receivers / Transceivers and Optical Sensors (2016.09.29)
A new online tool from the Optoelectronics group of Vishay Intertechnology, Inc. is speeding up a time-consuming task for designers of home entertainment systems. Anything that uses a remote control needs a window with precise dimensions to ensure that it can see the infrared (IR) signal from the remote |
|
54% of TSMC’s 2016 Revenue Expected to Come From <40nm, IC Insight Says (2016.09.29)
According to the IC Insight, TSMC has long been the technology leader among the major pure-play foundries. 54% of TSMC’s 2016 revenue is expected to come from |
|
HOLTEK BH66F5233 24-bit Delta Sigma A/D Flash MCU (2016.09.26)
Holtek announced the release of a new addition to its 24-bit Delta Sigma A/D Flash type range, the BH66F5233. The device meets with industrial specification requirements of -40°C ~ 85°C operating temperature and has high noise immunity |
|
Four IC Industry Clusters Have Emerged in China, TrendForce Reports (2016.09.26)
The development of China’s semiconductor sector has gained new momentum in the first year of the country’s 13th Five-Year Plan (2016~2020). According to the global market research firm TrendForce, committed policy efforts and investments from the Chinese government have resulted in the formation of four IC industry clusters that are respectively located in the country’s four major regions of activities – the Yangtze River Delta |
|
eMemory Receives TSMC IP Partner Award (2016.09.26)
Hsinchu, Taiwan – eMemory announced that it has received TSMC’s Open Innovation Platform (OIP) IP Partner Award again. The selection was made based on comprehensive consideration and judgment. TSMC has honored eMemory with this award since 2010, rewarding eMemory’s commitment to offering comprehensive logic NVM IPs in a variety of TSMC processes |
|
50Msps, 16-Bit DAC Demonstration Board Has Mojo (2016.09.15)
Linear Technology Corporation introduces demonstration circuit 2459A, featuring the LTC1668, 50Msps, 16-bit digital-to-analog converter (DAC). This high performance DAC is very popular in applications with analog frequency content between the audio range and several megahertz |
|
Asia-Pacific To Top 2016 Regional IC Sales In Major System Categories (2016.09.15)
Asia-Pacific’s grip as the dominant market for IC sales is forecast to strengthen in 2016 with the region expected to account for 61.0% of the $282.0 billion IC market this year, according to IC Insights.
The forecast calls for another small gain in total IC marketshare in 2016 after Asia-Pacific held 57 |
|
High Image Quality, H.264 Full-HD Multi-Channel Codec (2016.09.14)
Socionext Inc., announced the release of SC2M15, a new codec IC designed for video transmission equipment. The device can process decoding, transcoding and encoding of H.264/HVC video and audio signals with a single chip, and is suitable for applications including digital broadcasting and video streaming through Internet Protocol among others |
|
Stabilization of NAND Flash Market With Revenue Rising 3.4% Sequentially in Q2, TrendForce Says (2016.09.13)
In the second quarter of 2016, demand for high-capacity eMMC/eMCP from Chinese smartphone brands and the stock-up activities ahead of the iPhone 7 release caused a gradual tightening of NAND Flasrh supply. The decline in contract prices for eMMC and SSDs of both client and enterprise grade also started to ease during the same period, according to the latest report from DRAMeXchange, a division of TrendForce |
|
German Scientists Discovers a New Flexible Semiconductor for Electronics (2016.09.13)
A team from the Technical University of Munich (TUM) has discovered a double helix structure in an inorganic material. The material comprising tin, iodine and phosphorus is a semiconductor with extraordinary optical and electronic properties, as well as extreme mechanical flexibility |
|
DRAM and NAND Flash Prices Set to Grow Sharply in Q4 (2016.09.12)
TAIPEI, Taiwan - According to news from Taiwan's Economic Daily News, following the lead of DRAM and NAND Flash price growth for the Korean companies, Samsung and SK Hynix Semiconductor Inc.,, DRAM prices are expected to increase an additional 10% in the fourth quarter |
|
HD-DMB TCC5700 Chipset with Hardwired HEVC Decoder (2016.09.10)
Telechips announced HD (High-Definition) DMB TCC5700 chipset which will be launched in the end of September. Telechips minimizes thermal characteristics of the HD-DMB chipset by reducing CPU load with hardwired HEVC (H.265) decoder embedded on the TCC5700 chipset |
|
GLOBALFOUNDRIES unveils New 12nm FD-SOI Semiconductor Technology (2016.09.09)
GLOBALFOUNDRIES today unveiled its new 12nm FD-SOI semiconductor technology in Shanghai, China, the company’s next-generation 12FDX platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles |
|
Wide Terminal Thin Film Chip Resistors Features 1 W Power Rating in Compact 0612 Case Size (2016.09.09)
Vishay Intertechnology announced that the company has extended its MCW AT Professional family of wide terminal thin film chip resistors by supplementing the existing MCW 0406 AT line with an additional case size for power handling of up to 1 W |
IBM's AIX, Sun's Solaris, HP's HP-UX, or Linux, etc., are from 1969, AT & T Bell Laboratories (Bell Labs) developed Unix reviewing this history, MULTICS (MULTiplexed Informationand Computing Service) plan is an important key. .