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CTIMES / Semiconductor
Science and Technology
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-4,004 microprocessor Intel's rise to 8,080 proces

Intel because of the the Japan the Busicom Company's commissioned to design the chip, led to the birth of the 4004 microprocessor, they opened the era made ​​in a single chip computer core. Intel 1974, Intel redouble their efforts to develop the ancestor of the 8080 processor, and 4004 microprocessor with the CPU, but also created a future dominance of research and development in the central processor.
2016 Flash Memory Summit Highlighted Prominence of Chinese Vendors in Flash Industry (2016.08.25)
This year’s Flash Memory Summit was held from August 9 to 11 in Santa Clara, California. “For the second consecutive year, this major Flash memory industry conference held a special forum for discussing the Chinese market, with CEO of Sage Microelectronics Dr
Isolated Power Supply Control ICs for Industrial Inverters (2016.08.25)
ROHM has recently announced the availability of isolated flyback-type DC/DC converter control ICs for inverters in high power industrial equipment such as FA/solar inverters and power storage systems. Isolation is almost always built into electronic equipment to provide protection against shock and damage
TSMC, GlobalFoundries, UMC, SMIC Forecasted to Hold 84% share of the Pure-play Foundry Market (2016.08.24)
According to latest report from IC Insights that the sales of total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015. In 2014, the pure-play IC foundry market registered a strong 17% increase, the largest increase since 2010 and eight points greater than the 9% increase in the worldwide IC market
Low Power Wireless Charger for Hearing Aids (2016.08.23)
The LTC4123 is a low power wireless receiver and a constant-current/constant-voltage linear charger for NiMH batteries. An external programming resistor sets the charge current up to 25mA. The temperature compensated charge voltage feature protects the NiMH battery and prevents overcharging
Shipment of MCU Chips of Hua Hong Semiconductor Hits Historical Record (2016.08.23)
Hua Hong Semiconductor Limited, together with its subsidiaries, the "Group", a pure-play 200mm foundry, announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record
Toshiba to Implement "Eyefi Connected" Features in Its Wireless SD Card (2016.08.23)
Toshiba Corporation today announced that future generations of its FlashAir, an SD memory card supporting embedded wireless LAN communications, will implement “Eyefi Connected” features that the company has been granted the license from US-based Eyefi
Intel Debuts Its latest 14nm FPGA chip- Stratix 10 (2016.08.19)
At its IDF 2016 yesterday, Intel for the first time set up a section to address its FPGA products strategy and showcase the latest 14nm Tri-Gate process FPGA chip- Stratix 10. Intel CEO Brian Krzanich said that Intel will keep investing in two growing FPGA business, new FPGA and SoC FPGA product roadmaps, and continuing to provide the service and support that customers have come to expect from Altera
Miniature Minimold Through-Hole IR Receivers (2016.08.19)
Vishay Intertechnology broadened its optoelectronics portfolio with the introduction of two new series of miniature infrared (IR) receiver modules for IR remote control applications in consumer products. Offered in the new Minimold package, Vishay Semiconductors TSOP33xxx and TSOP53xxx series devices deliver the same RF noise rejection as Minicast receivers while surpassing the high optical performance of Mold package devices
Should TSMC Worry About Intel Cooperating with ARM? (2016.08.18)
Many people had asked Morris Chang, the chairman of TSMC, that how does TSMC compete with other world leading semiconductor firms in the ICs foundry business? The wise, humor and all-time leader of TSMC always given they the same answer, “We are foundry”
Ultrathin µModule Regulator Gets Closer to FPGAs, GPUs, ASICs or Processors (2016.08.16)
Linear Technology Corporation introduces the LTM4631, a dual 10A or single 20A µModule (power module) step-down regulator in an ultrathin 1.91mm LGA package with a 16mm x 16mm footprint. The LTM4631 can be placed on a PC board very close to its load such as an FPGA, while sharing one heat sink covering both of their low profile packages
Expanding Chinese Branded Smartphones Led to 17.2% Increase in Mobile DRAM Revenue (2016.08.15)
The latest research from DRAMeXchange, a division of TrendForce, finds that the global mobile DRAM revenue grew 17.2% sequentially in the second quarter, benefitting all top three DRAM suppliers. Expanding Chinese branded smartphone shipments, driven by Huawei, OPPO and Vivo, as well as bit supply growth in the mobile DRAM market, attributed to this revenue increase
EVA-M8Q GNSS Receiver Delivers High Acquisition and Tracking Sensitivity with Small Antennas (2016.08.15)
u-blox announced the EVA-M8Q GNSS receiver, completing its lineup of receivers in the miniature and cost-effective EVA 7x7mm form-factor package. The EVA-M8Q is TCXO-based and is optimized to provide the highest acquisition and tracking sensitivity, making it ideal for use with small antennas either in covert applications such as asset tracking and stolen vehicle recovery, or in portable devices
Samsung to Provide 4th-Gen 64-layer V-NAND Flash Products in Q4 (2016.08.11)
At Flash Memory Summit 2016, held in the Santa Clara (CA) Convention Center, Samsung showcased its 4th generation Vertical NAND (V-NAND) and a line-up of high-performance, high-capacity solid state drives (SSDs) available for its enterprise customers as well as Z-SSD, a new solution providing breakthrough performance for flash-based storage
TSIA Expects Taiwan IC revenue to reach US$74.9B in 2016 (2016.08.11)
According to the TSIA’s survey, the Q2 2016 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled US$18.6B, up 10.5% on-quarter and 8.2% increase on-year. In design, with US$5.2B (16
VLP DDR4 mini ECC UDIMM series From Apacer (2016.08.11)
Apacer Technology has launched the VLP DDR4 mini ECC UDIMM which is especially designed for networking, telecom and industrial automation systems. Delivering advantages such as space-saving, high-speed data transmission and low power consumption, it is a perfect fit for network communication and embedded industrial automation equipment, optimizing high-performance cloud operating systems
Highly Integrated Hall Sensors Reduce Systems Costs Considerably (2016.08.10)
The new Hall sensors of Infineon Technologies AG enable automotive, industrial and consumer electronics to meet strict environmental standards. Also, they help fulfil the requirements of very cost-effective and compact designs
D/A Converter Offers More Accuracy in a Smaller Footprint (2016.08.09)
Analog Devices, Inc. (ADI) introduced the AD9164 D/A converter that brings high resolution radar images for designers of military and commercial radar while reducing solution component count. Additionally, for designers of precision instrumentation equipment
Avnet Adds SiTime’s MEMS Timing Solutions to Line Cards in Americas and Asia (2016.08.09)
Avnet, Inc. today announced a distribution agreement with SiTime Corporation, a MEMS and analog semiconductor company and wholly owned subsidiary of MegaChips Corporation. Effective immediately, Avnet will offer SiTime’s MEMS oscillators in the Americas and Asia, excluding Japan
MegaChips Delivers High Quality Multimedia Converter IC with HDCP2.2 Protection (2016.08.09)
MegaChips Corporation announced production shipments of the MCDP2900, an advanced audio-video converter, featuring unprecedented user experience features like HDR and HDCP2.2 repeater functions. The power-optimized converter facilitates secured transmission of 4K60Hz High Dynamic Range (HDR) content between personal, mobile, and consumer electronics through USB Type-C and other digital display interfaces
China Further Fortifies Its Semiconductor Sector With Formation of High-End Chip Alliance (2016.08.08)
With the government’s backing, key enterprises in China’s semiconductor sector have just established a “high-end chip alliance” that fosters the formation of a vertically integrated industry ecosystem on a national scale

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