Samsung Unveils New Power Management Solutions for DDR5 Modules (2021.05.20) Samsung Electronics announced the industry’s first integrated power management ICs (PMICs) S2FPD01, S2FPD02 and S2FPC01, for the fifth-generation double data rate (DDR5) dual in-line memory module (DIMM).
One major des
意法半导体新款超薄低压降线性稳压器采用无凸点晶片级封装 (2016.09.09) 意法半导体(STMicroelectronics,简称ST)推出一款尺寸极小的LDBL20 200mA低压降线性稳压器(LDO)。新产品采用0.47mm x 0.47mm x 0.2mm晶片级封装,乃穿戴式设备、可携式装置以及多功能连网智慧卡等用灵活装置的理想选择
凌力尔特发表新款DC/DC uModule稳压器 (2016.02.26) 凌力尔特(Linear Technology)日前发表DC/DC μModule稳压器LTM8067 及LTM8068,元件具备2kVAC电气隔离,并包括隔离变压器、控制电路、电源开关和其他支援零件,采用9mm x 11.25mm x 4.92mm BGA(球栅阵列)封装